Add to ORKGThin film based industries (OLED; Organic photovoltaic, CIS-thin film photovoltaic) require very dense layers. Fraunhofer IPA investigations showed that besides process parameters also contamination have an impact on the barrier of a layers. The main contamination risks are particles on substrates regarding layer penetration. Airborne molecular contamination (AMC) caused e.g. by out-gassing of materials can have a strong impact as well
An overview is given on the actual situation for flexible packaging media on base of transparent thi...
This paper reports on the progress of the NanoCleaR project, which began in Januaray of 2012. With f...
Atomic layer deposition (ALD) is an efficient tool for improving the barrier properties of polymer f...
Organic airborne molecular contamination in semiconductor device manufacturing has gained importance...
This paper reports on the recent work carried out as part of the EU funded NanoMend project. The pro...
Atomic layer deposition (ALD) is a surface controlled layer-by-layer process based on self-limiting ...
Atomic layer deposition (ALD) is an efficient tool for improving the barrier properties of polymer f...
The packaging industry replaces more and more heavy packaging materials by lighter materials, especi...
Barrier films deposited on flexible substrates are indispensable for a lot of applications. These ar...
For semiconductor components, the demand to improve performance and velocity as well as energy consu...
One of the critical issues still facing the implementation of extreme ultraviolet lithography (EUVL)...
An overview is given on the actual situation for packaging media on base of thin barrier films, star...
Atomic layer deposition (ALD) is an efficient tool for improving the barrier properties of polymer f...
Flexible and organic electronic devices for photovoltaic, display and lighting application attract g...
The key requirement in manufacturing flexible organic lightemitting displays (OLEDs) is to protect t...
An overview is given on the actual situation for flexible packaging media on base of transparent thi...
This paper reports on the progress of the NanoCleaR project, which began in Januaray of 2012. With f...
Atomic layer deposition (ALD) is an efficient tool for improving the barrier properties of polymer f...
Organic airborne molecular contamination in semiconductor device manufacturing has gained importance...
This paper reports on the recent work carried out as part of the EU funded NanoMend project. The pro...
Atomic layer deposition (ALD) is a surface controlled layer-by-layer process based on self-limiting ...
Atomic layer deposition (ALD) is an efficient tool for improving the barrier properties of polymer f...
The packaging industry replaces more and more heavy packaging materials by lighter materials, especi...
Barrier films deposited on flexible substrates are indispensable for a lot of applications. These ar...
For semiconductor components, the demand to improve performance and velocity as well as energy consu...
One of the critical issues still facing the implementation of extreme ultraviolet lithography (EUVL)...
An overview is given on the actual situation for packaging media on base of thin barrier films, star...
Atomic layer deposition (ALD) is an efficient tool for improving the barrier properties of polymer f...
Flexible and organic electronic devices for photovoltaic, display and lighting application attract g...
The key requirement in manufacturing flexible organic lightemitting displays (OLEDs) is to protect t...
An overview is given on the actual situation for flexible packaging media on base of transparent thi...
This paper reports on the progress of the NanoCleaR project, which began in Januaray of 2012. With f...
Atomic layer deposition (ALD) is an efficient tool for improving the barrier properties of polymer f...