Influence of nano silver filler content on properties of ink-jet printed structures for microelectronics

The influence of nano silver filler content on properties of ink-jet printed structures for microelectronics were investigated. Samples were prepared by using ink with different nano silver filler content: 44%, 41% and 38%. The electrical measurements were performed during and after heating process. It was shown, that filler content does not have a strong influence on sintering time, but it changes the final resistivity of printed and sintered structures. The enhancement of sintering process by UV exposure was also investigated. Preliminary results are promising and the further study will be conducted