In this paper we present a detailed investigation on the influence of carbon co-implantation in the source/drain extension on leakage current and defect density in PFET transistors. Carbon is used to reduce the transient enhanced boron diffusion, to decrease short channel effects and to control the overlap length of the transistor. Leakage currents are measured and separated in order to analyze the influence of the carbon on the different MOSFET regions. An increase in carbon dose by a factor of 1.15 leads to an enhanced source/drain extension leakage which is caused by carbon induced defects. No effect of the carbon implantation on source/drain junction leakage was found as the co-implant is located above the source/drain depletion region....
We have systematically studied the origin of high gate-leakage currents in AlGaN/GaN high electron m...
An investigation into excess reverse leakage current of p-n junction process control structures in...
Le dopage est une étape clé de la fabrication des composants : de la quantité de dopants actifs dans...
In this paper we present a detailed investigation on the influence of carbon co-implantation in the ...
A good control of the transient enhanced dopant diffusion is needed for MOSFET scaling down to the s...
La conception de transistors bipolaires de moindre coût nécessite entre-autres l’implémentation d’un...
High-energy ion implantation is used for forming the collector in vertical bipolar transistors in a ...
Ion implantation is used for realization of the collector in vertical bipolar transistors in a BiCMO...
As device dimensions shrink to submicron levels, good design of ultrashallow junctions has become in...
This paper experimentally shows the reduction of anomalous narrow width effect (NWE) observed in gat...
This paper describes the impact of the deep boron implantation energy and dose on the electrical pro...
The development of a cost-effective bipolar transistor requires a collector doped by ion implantatio...
The gate leakage (I Gate, table 1) is reduced compared to the conventional 65nm process with SiON di...
This paper is the first to quantify drain extension leakage in a sub-100-nm gate-length bulk germani...
The effects of bulk microdefects and metallic impurities on leakage currents at p-n junctions have b...
We have systematically studied the origin of high gate-leakage currents in AlGaN/GaN high electron m...
An investigation into excess reverse leakage current of p-n junction process control structures in...
Le dopage est une étape clé de la fabrication des composants : de la quantité de dopants actifs dans...
In this paper we present a detailed investigation on the influence of carbon co-implantation in the ...
A good control of the transient enhanced dopant diffusion is needed for MOSFET scaling down to the s...
La conception de transistors bipolaires de moindre coût nécessite entre-autres l’implémentation d’un...
High-energy ion implantation is used for forming the collector in vertical bipolar transistors in a ...
Ion implantation is used for realization of the collector in vertical bipolar transistors in a BiCMO...
As device dimensions shrink to submicron levels, good design of ultrashallow junctions has become in...
This paper experimentally shows the reduction of anomalous narrow width effect (NWE) observed in gat...
This paper describes the impact of the deep boron implantation energy and dose on the electrical pro...
The development of a cost-effective bipolar transistor requires a collector doped by ion implantatio...
The gate leakage (I Gate, table 1) is reduced compared to the conventional 65nm process with SiON di...
This paper is the first to quantify drain extension leakage in a sub-100-nm gate-length bulk germani...
The effects of bulk microdefects and metallic impurities on leakage currents at p-n junctions have b...
We have systematically studied the origin of high gate-leakage currents in AlGaN/GaN high electron m...
An investigation into excess reverse leakage current of p-n junction process control structures in...
Le dopage est une étape clé de la fabrication des composants : de la quantité de dopants actifs dans...