The invention relates to a process and an apparatus for producing covering electrodes on organic electronic elements. It is an object of the invention to provide possible ways of producing covering electrodes on organic electronic elements, by means of which these covering electrodes can be formed with a constant layer thickness and at a reproducible and increased coating rate while avoiding defects or influencing of organic layer components. According to the invention, semifinished parts for organic electronic elements without covering electrodes are arranged at a distance from at least two targets made of the covering electrode material in a vacuum chamber. The semifinished parts and the targets with in each case a magnetron sputtering so...
DE 10300439 A UPAB: 20040813 NOVELTY - To treat a material surface, e.g. to degrease a metal foil, a...
DE 4338478 C UPAB: 19941206 In an electron-induced material deposition process, an electrically cond...
DE 19947935 A UPAB: 20010508 NOVELTY - Apparatus for magnetron sputtering comprises targets (1,2) su...
The process comprises immobilizing a substrate using a substrate holder on a rotary plate, and depos...
DE 102005054609 A1 UPAB: 20070727 NOVELTY - A device for producing organic light emitting elements c...
The description refers to a process and a device for the free-forming production of three-dimensiona...
A process is used for the production of coated workpieces made of totally or only partially electric...
An apparatus for coating electrically conductive components, or other materials, comprises an electr...
WO 200236851 A UPAB: 20020919 NOVELTY - To process the surface(s) of at least one electrically insul...
The process and the associated device permits the high-rate coating of large-surface electrically co...
Process for the electrostatic coating of substrates arranged in the region between two emission devi...
WO 2010069594 A1 UPAB: 20100714 NOVELTY - The process comprises activating the vapor from a coating ...
The element has an electrolyte arranged between an electrode (10) and a counter electrode. The elect...
WO 200013201 A UPAB: 20000426 NOVELTY - A positively charged absorber electrode (2) is positioned in...
WO2003029511 A UPAB: 20030526 NOVELTY - Process for depositing silver-containing metal layers having...
DE 10300439 A UPAB: 20040813 NOVELTY - To treat a material surface, e.g. to degrease a metal foil, a...
DE 4338478 C UPAB: 19941206 In an electron-induced material deposition process, an electrically cond...
DE 19947935 A UPAB: 20010508 NOVELTY - Apparatus for magnetron sputtering comprises targets (1,2) su...
The process comprises immobilizing a substrate using a substrate holder on a rotary plate, and depos...
DE 102005054609 A1 UPAB: 20070727 NOVELTY - A device for producing organic light emitting elements c...
The description refers to a process and a device for the free-forming production of three-dimensiona...
A process is used for the production of coated workpieces made of totally or only partially electric...
An apparatus for coating electrically conductive components, or other materials, comprises an electr...
WO 200236851 A UPAB: 20020919 NOVELTY - To process the surface(s) of at least one electrically insul...
The process and the associated device permits the high-rate coating of large-surface electrically co...
Process for the electrostatic coating of substrates arranged in the region between two emission devi...
WO 2010069594 A1 UPAB: 20100714 NOVELTY - The process comprises activating the vapor from a coating ...
The element has an electrolyte arranged between an electrode (10) and a counter electrode. The elect...
WO 200013201 A UPAB: 20000426 NOVELTY - A positively charged absorber electrode (2) is positioned in...
WO2003029511 A UPAB: 20030526 NOVELTY - Process for depositing silver-containing metal layers having...
DE 10300439 A UPAB: 20040813 NOVELTY - To treat a material surface, e.g. to degrease a metal foil, a...
DE 4338478 C UPAB: 19941206 In an electron-induced material deposition process, an electrically cond...
DE 19947935 A UPAB: 20010508 NOVELTY - Apparatus for magnetron sputtering comprises targets (1,2) su...