In this paper we present a detailed investigation on the influence of carbon co-implantation in the source/drain extension on the leakage current and defect density in PFET transistors. Carbon is used to reduce the transient enhanced boron diffusion, to decrease short channel effects and to control the overlap length of the transistor. The leakage currents are measured and separated in order to analyze the influence of the carbon on the different MOSFET regions. The carbon implantation dose is varied between 3.5 × 1014 atm/cm2 and 4 × 1014 atm/cm 2. This small increase in implantation dose leads to an enhanced source/drain extension leakage which is caused by carbon induced defects. No effect of the carbon implantation on the source/drain j...
The effects of bulk microdefects and metallic impurities on leakage currents at p-n junctions have b...
Boron- and BF2-implanted p+-n junctions are compared. At 50V reverse bias BFf- implanted iodes, fabr...
Le dopage est une étape clé de la fabrication des composants : de la quantité de dopants actifs dans...
In this paper we present a detailed investigation on the influence of carbon co-implantation in the ...
A good control of the transient enhanced dopant diffusion is needed for MOSFET scaling down to the s...
La conception de transistors bipolaires de moindre coût nécessite entre-autres l’implémentation d’un...
Ion implantation is used for realization of the collector in vertical bipolar transistors in a BiCMO...
High-energy ion implantation is used for forming the collector in vertical bipolar transistors in a ...
As device dimensions shrink to submicron levels, good design of ultrashallow junctions has become in...
This paper experimentally shows the reduction of anomalous narrow width effect (NWE) observed in gat...
This paper describes the impact of the deep boron implantation energy and dose on the electrical pro...
The development of a cost-effective bipolar transistor requires a collector doped by ion implantatio...
The gate leakage (I Gate, table 1) is reduced compared to the conventional 65nm process with SiON di...
An investigation into excess reverse leakage current of p-n junction process control structures in...
We have systematically studied the origin of high gate-leakage currents in AlGaN/GaN high electron m...
The effects of bulk microdefects and metallic impurities on leakage currents at p-n junctions have b...
Boron- and BF2-implanted p+-n junctions are compared. At 50V reverse bias BFf- implanted iodes, fabr...
Le dopage est une étape clé de la fabrication des composants : de la quantité de dopants actifs dans...
In this paper we present a detailed investigation on the influence of carbon co-implantation in the ...
A good control of the transient enhanced dopant diffusion is needed for MOSFET scaling down to the s...
La conception de transistors bipolaires de moindre coût nécessite entre-autres l’implémentation d’un...
Ion implantation is used for realization of the collector in vertical bipolar transistors in a BiCMO...
High-energy ion implantation is used for forming the collector in vertical bipolar transistors in a ...
As device dimensions shrink to submicron levels, good design of ultrashallow junctions has become in...
This paper experimentally shows the reduction of anomalous narrow width effect (NWE) observed in gat...
This paper describes the impact of the deep boron implantation energy and dose on the electrical pro...
The development of a cost-effective bipolar transistor requires a collector doped by ion implantatio...
The gate leakage (I Gate, table 1) is reduced compared to the conventional 65nm process with SiON di...
An investigation into excess reverse leakage current of p-n junction process control structures in...
We have systematically studied the origin of high gate-leakage currents in AlGaN/GaN high electron m...
The effects of bulk microdefects and metallic impurities on leakage currents at p-n junctions have b...
Boron- and BF2-implanted p+-n junctions are compared. At 50V reverse bias BFf- implanted iodes, fabr...
Le dopage est une étape clé de la fabrication des composants : de la quantité de dopants actifs dans...