Efficient target preparation by combining laser ablation and FIB milling in a single tool

Analysis of samples from 3D integration, packaging and joining technologies more often than ever requires the removal of large amounts of material to access deeply buried target structures. Until now, such sample preparation has been achieved using demanding and slow techniques, such as metallographic cross-sectioning, or focused ion beam (FIB) milling. A new tool that combines pulsed laser ablation and FIB milling now allows precise target preparation of deeply buried features in a more efficient way