Add to ORKGA green solid state laser for the joint ESA/NASA EXOMARS mission is presented. Multi-material integration on smart AIN-based ceramic substrate using flux-free laser-based soldering techniques is described. Solder joining allows for an organic-free assembly of the redundant two channel design of a Nd:YAG laser with BBO second harmonic generation. Investigation of the soldering processes is carried out with respect of the most crucial components of the laser assembly, particulary the resonator mirror and the fold mirror. Possible solder joint designs are investigated with respect to achievable alignment accuracy. Two different flux free laser soldering processes are used: thin film soldering utilizing a sputtered eutectic gold-tin solder and ...
Based on the development of an adhering and solderable layer system microoptical subsystems are join...
Laser-based Solderjet Bumping is a fast, precise and versatile technique for flux-free soldering of ...
We present Solderjet Bumping, a laser-based soldering process, as an all inorganic joining technique...
A Soldering technique based on laser-induced Solderjet Bumping is used to assemble a miniaturized la...
System integration of complex and demanding micro-systems requires advanced packaging technologies. ...
Solder-joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based solde...
Joining of micro-optical systems is an important step during the manufacturing process, especially w...
This master thesis presents the research performed to reach the optimum assembling technique for the...
A miniaturized diode-pumped solid-state laser (DPSSL) designed as part of the Raman laser spectromet...
Laser based solder bumping is a highly flexible and fast approach for flux-free soldering of micro-o...
We present Solderjet Bumping, a laser-based soldering process, as an all inorganic joining technique...
Laser beam soldering as a longterm and temperature stable joining alternative to adhesive bonding fo...
Miniaturization of photonic devices is required by various applications such as data storage and pro...
In this paper we present the development of a compact, thermo-optically stable and vibration and mec...
Based on the development of an adhering and solderable layer system microoptical systems are joined ...
Based on the development of an adhering and solderable layer system microoptical subsystems are join...
Laser-based Solderjet Bumping is a fast, precise and versatile technique for flux-free soldering of ...
We present Solderjet Bumping, a laser-based soldering process, as an all inorganic joining technique...
A Soldering technique based on laser-induced Solderjet Bumping is used to assemble a miniaturized la...
System integration of complex and demanding micro-systems requires advanced packaging technologies. ...
Solder-joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based solde...
Joining of micro-optical systems is an important step during the manufacturing process, especially w...
This master thesis presents the research performed to reach the optimum assembling technique for the...
A miniaturized diode-pumped solid-state laser (DPSSL) designed as part of the Raman laser spectromet...
Laser based solder bumping is a highly flexible and fast approach for flux-free soldering of micro-o...
We present Solderjet Bumping, a laser-based soldering process, as an all inorganic joining technique...
Laser beam soldering as a longterm and temperature stable joining alternative to adhesive bonding fo...
Miniaturization of photonic devices is required by various applications such as data storage and pro...
In this paper we present the development of a compact, thermo-optically stable and vibration and mec...
Based on the development of an adhering and solderable layer system microoptical systems are joined ...
Based on the development of an adhering and solderable layer system microoptical subsystems are join...
Laser-based Solderjet Bumping is a fast, precise and versatile technique for flux-free soldering of ...
We present Solderjet Bumping, a laser-based soldering process, as an all inorganic joining technique...