With multilayer technology it is possible to manufacture miniaturized ceramic sensors based on ceramic substrates. The sensor body can be geometrically structured in three dimensions, can have integrated electrical wiring and is usually equipped with functional materials forming fine sensory structures. There is a wide variety of producible sensors ranging from mechanical sensors to chemical sensors. The following article tells something about the developments conducted at Fraunhofer IKTS. It starts with the materials used in ceramic multilayer technology, shows something about the processes used for the build-up of a sensor assembly and finally shows some more details of selected sensor types
There is a need for low-profile piezoelectric modules directly integrated into structural components...
Silicon sensors date back to before 1960 with early Hall and piezoresistive devices. These used simp...
At the Fraunhofer IKTS the principle of manufacturing of components with graded microstructure by mu...
The paper describes the manufacturing of 3D structured Microsystems based on the LTCC/HTCC Multilaye...
With the advancement in Information and Communication Technology (ICT), cities, countries and many ...
Recent technological innovations, such as material printing techniques and surface functionalization...
LTCC (Low Temperature Co fired Ceramic) is a ceramic multilayer technology for the manufacturing of ...
The ceramic thick-film technology enables the build-up of miniaturised and robust integrated multila...
Gas sensors are devices that change their physico-chemical properties according to the ambient gas, ...
The work describes a fast and flexible micro/nano fabrication and manufacturing method for ceramic M...
The contribution presents the development results of a new technological platform based on the combi...
For the manufacturing of novel functional ceramic components Ceramic Multilayer Technology (MLC) und...
Within the Fraunhofer-Institute of Ceramic Technologies and Sintered Materials ceramic for electroni...
A platform for the wireless transmission of data at high temperature is presented. The platform is d...
DE 102006018049 A1 UPAB: 20071113 NOVELTY - The sensor has a carrier, which is formed from several c...
There is a need for low-profile piezoelectric modules directly integrated into structural components...
Silicon sensors date back to before 1960 with early Hall and piezoresistive devices. These used simp...
At the Fraunhofer IKTS the principle of manufacturing of components with graded microstructure by mu...
The paper describes the manufacturing of 3D structured Microsystems based on the LTCC/HTCC Multilaye...
With the advancement in Information and Communication Technology (ICT), cities, countries and many ...
Recent technological innovations, such as material printing techniques and surface functionalization...
LTCC (Low Temperature Co fired Ceramic) is a ceramic multilayer technology for the manufacturing of ...
The ceramic thick-film technology enables the build-up of miniaturised and robust integrated multila...
Gas sensors are devices that change their physico-chemical properties according to the ambient gas, ...
The work describes a fast and flexible micro/nano fabrication and manufacturing method for ceramic M...
The contribution presents the development results of a new technological platform based on the combi...
For the manufacturing of novel functional ceramic components Ceramic Multilayer Technology (MLC) und...
Within the Fraunhofer-Institute of Ceramic Technologies and Sintered Materials ceramic for electroni...
A platform for the wireless transmission of data at high temperature is presented. The platform is d...
DE 102006018049 A1 UPAB: 20071113 NOVELTY - The sensor has a carrier, which is formed from several c...
There is a need for low-profile piezoelectric modules directly integrated into structural components...
Silicon sensors date back to before 1960 with early Hall and piezoresistive devices. These used simp...
At the Fraunhofer IKTS the principle of manufacturing of components with graded microstructure by mu...