Technology progress in IC manufacturing is characterized by decreasing the minimum feature sizes used in the fabrication process. With scaling also the impact of the variations increases. The process variations can be divided into inter-die and intra-die variations respectively. It is now interesting in the design process to determine how the known randomness of process parameters influences the randomness of performance parameters of a system such as delay times and energy consumption. It will be shown how randomness of performance parameters as well variations of parameters of behavioural models can be described regarding inter-die and intra-die variations. The approach bases on marginal distributions of the parameters and their Spearman'...
In the past few decades, the semiconductor industry kept shrinking the feature size of CMOS transist...
Since semiconductor structure sizes reached the regime of 100~nm and below, global and local process...
Nowadays the highest device integration affects the design process in several ways. The process vari...
The scaling of MOSFETs has improved performance and lowered the cost per function of CMOS integrated...
In the manufacturing of VLSI circuits, engineering designs should take into consideration random var...
Variability continues to pose challenges to integrated circuit design. With statistical static timin...
In the manufacturing of VLSI circuits, engineering designs should take into consideration random var...
In the manufacturing of VLSI circuits, engineering designs should take into consideration random var...
A new model has been developed for the covariance matrix of device parameters. The analysis has been...
A new model has been developed for the covariance matrix of device parameters. The analysis has been...
A new model has been developed for the covariance matrix of device parameters. The analysis has been...
In today's semiconductor technology, the size of a transistor is made smaller and smaller. One of th...
The various devices (transistors, resistors, etc.) in an integrated semiconductor circuit have very ...
Widely used approaches to modeling random effects and extracting random parameters in matching-criti...
Aggressive device scaling has made it imperative to account for process variations in the design flo...
In the past few decades, the semiconductor industry kept shrinking the feature size of CMOS transist...
Since semiconductor structure sizes reached the regime of 100~nm and below, global and local process...
Nowadays the highest device integration affects the design process in several ways. The process vari...
The scaling of MOSFETs has improved performance and lowered the cost per function of CMOS integrated...
In the manufacturing of VLSI circuits, engineering designs should take into consideration random var...
Variability continues to pose challenges to integrated circuit design. With statistical static timin...
In the manufacturing of VLSI circuits, engineering designs should take into consideration random var...
In the manufacturing of VLSI circuits, engineering designs should take into consideration random var...
A new model has been developed for the covariance matrix of device parameters. The analysis has been...
A new model has been developed for the covariance matrix of device parameters. The analysis has been...
A new model has been developed for the covariance matrix of device parameters. The analysis has been...
In today's semiconductor technology, the size of a transistor is made smaller and smaller. One of th...
The various devices (transistors, resistors, etc.) in an integrated semiconductor circuit have very ...
Widely used approaches to modeling random effects and extracting random parameters in matching-criti...
Aggressive device scaling has made it imperative to account for process variations in the design flo...
In the past few decades, the semiconductor industry kept shrinking the feature size of CMOS transist...
Since semiconductor structure sizes reached the regime of 100~nm and below, global and local process...
Nowadays the highest device integration affects the design process in several ways. The process vari...