An analysis of moisture transport through the bulk of a crosslinked epoxy has been performed experimentally and by molecular dynamics simulations. It was shown that results of the diffusion coefficient compare well for the investigated system and an analysis of the activation energy gives reasonable agreement between experiment and simulation
This paper addresses the potential of molecular dynamics simulation for structure-property correlati...
The delamination at the copper lead frame and the epoxy interface adversely affects the reliability ...
Molecular dynamics simulation can be used to explore the detailed effects of chemistry on properties...
We have investigated the capability to predict moisture induced swelling of an epoxy by use of molec...
Moisture-related failure is one of the main concerns in the integrated circuit (IC) package design. ...
Epoxy Mold Compounds (EMC) are used to protect integrated circuits (IC) from environmental influence...
Epoxy Mold Compounds (EMC) are used to protect integrated circuits (IC) from environmental influence...
In spite of a high market share of plastic IC packaging, there are still reliability issues, especia...
ABSTRACT: Mathematical models are presented to describe moisture transport in epoxy composites using...
The epoxy resins used in high performance aerospace composites typically absorb significant quantiti...
© 2015 Elsevier B.V. All rights reserved. Classical all-atom molecular dynamics simulations were use...
Mechanical reliability of plastic packages for integrated circuit devices is significantly affected ...
In this paper the potential of molecular dynamics simulation for structure-property correlations in ...
Moisture-induced package failures such as interfacial delamination and pop-corn cracking are common ...
ABSTRACT: Absorbed moisture can degrade the physical properties of an epoxy resin, jeopardizing the ...
This paper addresses the potential of molecular dynamics simulation for structure-property correlati...
The delamination at the copper lead frame and the epoxy interface adversely affects the reliability ...
Molecular dynamics simulation can be used to explore the detailed effects of chemistry on properties...
We have investigated the capability to predict moisture induced swelling of an epoxy by use of molec...
Moisture-related failure is one of the main concerns in the integrated circuit (IC) package design. ...
Epoxy Mold Compounds (EMC) are used to protect integrated circuits (IC) from environmental influence...
Epoxy Mold Compounds (EMC) are used to protect integrated circuits (IC) from environmental influence...
In spite of a high market share of plastic IC packaging, there are still reliability issues, especia...
ABSTRACT: Mathematical models are presented to describe moisture transport in epoxy composites using...
The epoxy resins used in high performance aerospace composites typically absorb significant quantiti...
© 2015 Elsevier B.V. All rights reserved. Classical all-atom molecular dynamics simulations were use...
Mechanical reliability of plastic packages for integrated circuit devices is significantly affected ...
In this paper the potential of molecular dynamics simulation for structure-property correlations in ...
Moisture-induced package failures such as interfacial delamination and pop-corn cracking are common ...
ABSTRACT: Absorbed moisture can degrade the physical properties of an epoxy resin, jeopardizing the ...
This paper addresses the potential of molecular dynamics simulation for structure-property correlati...
The delamination at the copper lead frame and the epoxy interface adversely affects the reliability ...
Molecular dynamics simulation can be used to explore the detailed effects of chemistry on properties...