Novel analytical models for accurately modelling the shape and length of bond wires in dependence on the loop height (Lh(max)), distance between the bonding positions (d(bp)) and the thickness of the metallisation (t(met.)) on which the wires are bonded, are derived in this work. These analytical models, which are based on the Gaussian distribution function, are applied to (i) develop realistic three-dimensional electromagnetic models of bond wire antennas and study their radiation characteristics and (ii) study the impact of process tolerances of bond wire parameters on the performance of the antennas. For these studies, a 42 GHz half-loop bond wire antenna is considered as an example. It is designed, fabricated and measured. Our results r...
In this contribution, two-conductor and coplanar bond wire configurations are modeled, analyzed and ...
An approach to fast 3D modeling of the geometry for bonding in RF circuits and packages is demonstra...
International audienceThe dependence of self-inductance and mutual inductance on bonding wire (BW) g...
In this Letter, the authors present the experimental verification of an analytical model, which capt...
Due to the multitude of advantages bond wire antennas have over conventional planar antennas (especi...
In this paper, all the three steps required for implementing the M3-approach are illustrated for bon...
The theory, modeling, measurement and analysis of the radiation characteristics of bond wire antenna...
Novel analytical models for accurately and efficiently calculating the inductances of bond wires in ...
In this contribution, the authors present a systematic approach for optimizing the RF performance of...
The Uniform Theory of Diffraction (UTD) in conjunction with image theory is employed to develop a ve...
For the development of highly integrated millimeterwave front-end modules, a low-cost and high-perfo...
Bond-wire antennas provide a cost-effective method for radio transmission in the 60 GHz band. A new ...
Bonding wires are extensively used in integrated circuit (IC) packaging and circuit design in RF app...
We present the first comprehensive experimental characterization of bond wire interconnects at micro...
Due to the increasing number of components involved in Radio Frequency design, integration and packa...
In this contribution, two-conductor and coplanar bond wire configurations are modeled, analyzed and ...
An approach to fast 3D modeling of the geometry for bonding in RF circuits and packages is demonstra...
International audienceThe dependence of self-inductance and mutual inductance on bonding wire (BW) g...
In this Letter, the authors present the experimental verification of an analytical model, which capt...
Due to the multitude of advantages bond wire antennas have over conventional planar antennas (especi...
In this paper, all the three steps required for implementing the M3-approach are illustrated for bon...
The theory, modeling, measurement and analysis of the radiation characteristics of bond wire antenna...
Novel analytical models for accurately and efficiently calculating the inductances of bond wires in ...
In this contribution, the authors present a systematic approach for optimizing the RF performance of...
The Uniform Theory of Diffraction (UTD) in conjunction with image theory is employed to develop a ve...
For the development of highly integrated millimeterwave front-end modules, a low-cost and high-perfo...
Bond-wire antennas provide a cost-effective method for radio transmission in the 60 GHz band. A new ...
Bonding wires are extensively used in integrated circuit (IC) packaging and circuit design in RF app...
We present the first comprehensive experimental characterization of bond wire interconnects at micro...
Due to the increasing number of components involved in Radio Frequency design, integration and packa...
In this contribution, two-conductor and coplanar bond wire configurations are modeled, analyzed and ...
An approach to fast 3D modeling of the geometry for bonding in RF circuits and packages is demonstra...
International audienceThe dependence of self-inductance and mutual inductance on bonding wire (BW) g...