Ion implantation is the technique of choice for introducing dopant species into semiconductors in CMOS devices. In photovoltaics ion implantation could be an interesting alternative to tube furnace diffusion processes. In this work we thus show that the damage introduced during implantation can be completely removed during annealing and that a co-annealing process can be applied for the annealing of boron and phosphorus profiles. Boron emitter implanted PassDop as well as fully implanted PERT solar cells have been fabricated. High conversion efficiencies could be achieved for both, the PassDop (22.2%, 694 mV) as well as for the fully implanted PERT (22.3%, 684 mV) solar cells, proving the high quality of the applied boron and phosphorus imp...
AbstractWe developed a high efficiency N-type PERT (Passivated Rear Totally Diffused) bifacial struc...
P-type and n-type wafers were implanted with phosphorus and boron, respectively, for emitter formati...
Ion implantation is investigated as a method for forming the heavily doped regions of silicon solar ...
AbstractThe aim of the study was to develop a very simple process for the fabrication of large area ...
Ion implantation is the technique of choice for introducing dopant species into semiconductors in CM...
SiliconPV: March 25-27, 2013, Hamelin, GermanyInternational audienceThe aim of the study was to deve...
International audienceIon implantation has the advantage of being a unidirectional doping technique....
International audienceProduction costs and energy efficiency are the main priorities for the photovo...
Ion implantation offers new possibilities for silicon solar cell production, e.g. single side doping...
The main challenge for interdigitated back-contact (IBC) solar cells is to reduce the fabrication co...
International audienceIon implantation is a suitable and promising solution for the massive industri...
AbstractWe developed a high efficiency N-type PERT (Passivated Rear Totally Diffused) bifacial struc...
P-type and n-type wafers were implanted with phosphorus and boron, respectively, for emitter formati...
Ion implantation is investigated as a method for forming the heavily doped regions of silicon solar ...
AbstractThe aim of the study was to develop a very simple process for the fabrication of large area ...
Ion implantation is the technique of choice for introducing dopant species into semiconductors in CM...
SiliconPV: March 25-27, 2013, Hamelin, GermanyInternational audienceThe aim of the study was to deve...
International audienceIon implantation has the advantage of being a unidirectional doping technique....
International audienceProduction costs and energy efficiency are the main priorities for the photovo...
Ion implantation offers new possibilities for silicon solar cell production, e.g. single side doping...
The main challenge for interdigitated back-contact (IBC) solar cells is to reduce the fabrication co...
International audienceIon implantation is a suitable and promising solution for the massive industri...
AbstractWe developed a high efficiency N-type PERT (Passivated Rear Totally Diffused) bifacial struc...
P-type and n-type wafers were implanted with phosphorus and boron, respectively, for emitter formati...
Ion implantation is investigated as a method for forming the heavily doped regions of silicon solar ...