ZrO2-based MIM capacitors are used in various memory as well as for RF applications. Thus, material tuning is necessary to selectively optimize the electrical performance. In this paper, the C-V, J-V and reliability properties of Al-doped ZrO2 MIM capacitors with TiN electrodes are compared for different anneals showing minor differences between PDA and PMA in N2. However, there is a significant influence of a PDA in NH 3 that forms a two-phase system in the high-k layer
In this paper, the material and electrical properties of ZrO2 in metal-insulator-metal (MIM) DRAM ca...
The effect of the deposition temp. and layer thickness on the phys. and elec. properties of ZrO2-bas...
The influence of oxidation pulse during atomic layer deposition (ALD) process on electrical and diel...
The integration of passive devices on chip plays an important role in system miniaturization and ena...
ZrO2-based metal-insulator-metal capacitors are used in various volatile and nonvolatile memory devi...
As operating frequency and circuit density of VLSI systems continue to increase, the L*di/dt induced...
ZrO2-based metal-insulator-metal (MIM) capacitors are manufactured using atomic layer deposition. Th...
Polarity asymmetries in JSV and CSV characteristics of symmetrical MIM capacitors with amorphous and...
This paper focuses on zirconia and TiN based MIM buffer capacitors integrated in immediate vicinity ...
The memory behavior of Al/Ti/ZrO2:Al2O3/TiN/Si/Al devices is investigated in this work. They are ade...
Clear distinctions in the breakdown behavior of crystalline and amorphous dielectrics in MIM capacit...
We investigated ZrO2-based new dielectric materials for random access memory by pulsed laser deposit...
We provide the first report of the structural and electrical properties of TiN/ZrO 2 /Ti/Al metal-in...
A broad compositional range of the dielectric material Zr1-xHfxO2 was evaluated with respect to its ...
Embedded three-dimensional (3-D) metal-insulator-metal (MIM) decoupling capacitors with high-κ diele...
In this paper, the material and electrical properties of ZrO2 in metal-insulator-metal (MIM) DRAM ca...
The effect of the deposition temp. and layer thickness on the phys. and elec. properties of ZrO2-bas...
The influence of oxidation pulse during atomic layer deposition (ALD) process on electrical and diel...
The integration of passive devices on chip plays an important role in system miniaturization and ena...
ZrO2-based metal-insulator-metal capacitors are used in various volatile and nonvolatile memory devi...
As operating frequency and circuit density of VLSI systems continue to increase, the L*di/dt induced...
ZrO2-based metal-insulator-metal (MIM) capacitors are manufactured using atomic layer deposition. Th...
Polarity asymmetries in JSV and CSV characteristics of symmetrical MIM capacitors with amorphous and...
This paper focuses on zirconia and TiN based MIM buffer capacitors integrated in immediate vicinity ...
The memory behavior of Al/Ti/ZrO2:Al2O3/TiN/Si/Al devices is investigated in this work. They are ade...
Clear distinctions in the breakdown behavior of crystalline and amorphous dielectrics in MIM capacit...
We investigated ZrO2-based new dielectric materials for random access memory by pulsed laser deposit...
We provide the first report of the structural and electrical properties of TiN/ZrO 2 /Ti/Al metal-in...
A broad compositional range of the dielectric material Zr1-xHfxO2 was evaluated with respect to its ...
Embedded three-dimensional (3-D) metal-insulator-metal (MIM) decoupling capacitors with high-κ diele...
In this paper, the material and electrical properties of ZrO2 in metal-insulator-metal (MIM) DRAM ca...
The effect of the deposition temp. and layer thickness on the phys. and elec. properties of ZrO2-bas...
The influence of oxidation pulse during atomic layer deposition (ALD) process on electrical and diel...