Standard bulk CMOS technology targets operating temperatures of not more than 175°C. Silicon-on-insulator technologies are commonly used up to 250°C. In this work, we evaluate the limit for electronic circuit function realized in thin film SOI technologies for even higher temperatures. At Fraunhofer IMS, a versatile 1.0 µm SOI-CMOS process based on 200 mm wafers is available. It features three layers of tungsten metallization with excellent reliability concerning electromigration, as well as voltage-independent capacitors, various resistors, and single-poly-EEPROMs. We present a study of the temperature dependence of MOSFETs and basic circuits produced in the process. The electrical characteristics of an NMOSFET transistor and a PMOSFET tra...
The characteristics of enhancement-mode MOS transistors fabricated on zone-melting recrystallized (Z...
The purpose of this study was to design a Silicon-On-Insulator (SOI) CMOS band-gap voltage reference...
Microelectronic manufacturing progresses not only towards further miniaturisation, but also applicat...
Standard Bulk-CMOS-technology targets use-temperatures of not more than 175 °C. Silicon-on-Insulator...
Silicon-on-Insulator (SOI) is the most commonly used technology for integrated circuits capable of o...
This work investigates and demonstrates the potential of Silicon-On-Insulator (SOI) MOSFETs for high...
The high temperature characteristics of devices and circuits realized in complementary metal oxide s...
Today an increasing number of applications in fields like power electronics or sensor signal conditi...
The electrical characteristics of devices and circuits realized in CMOS technology on silicon-on-ins...
The hightemperature characteristics of devices and circuits realized in complementary metaloxidesemi...
Silicon-on-Insulator (SOI) CMOS technology constitutes a good candidate for mixed signal RF CMOS app...
The presented paper deals with the reliability of a 1.0 µm CMOS-SOI-process which is intended for us...
Standard Bulk-CMOS-technology targets use-temperatures of not more than 175 °C. With Silicon-on-Insu...
This paper presents the latest results of our research on SOI (Silicon-On-Insulator) technology for ...
The silicon-on-insulator (SOI) CMOS technology is one of the best candidates for high-temperature ap...
The characteristics of enhancement-mode MOS transistors fabricated on zone-melting recrystallized (Z...
The purpose of this study was to design a Silicon-On-Insulator (SOI) CMOS band-gap voltage reference...
Microelectronic manufacturing progresses not only towards further miniaturisation, but also applicat...
Standard Bulk-CMOS-technology targets use-temperatures of not more than 175 °C. Silicon-on-Insulator...
Silicon-on-Insulator (SOI) is the most commonly used technology for integrated circuits capable of o...
This work investigates and demonstrates the potential of Silicon-On-Insulator (SOI) MOSFETs for high...
The high temperature characteristics of devices and circuits realized in complementary metal oxide s...
Today an increasing number of applications in fields like power electronics or sensor signal conditi...
The electrical characteristics of devices and circuits realized in CMOS technology on silicon-on-ins...
The hightemperature characteristics of devices and circuits realized in complementary metaloxidesemi...
Silicon-on-Insulator (SOI) CMOS technology constitutes a good candidate for mixed signal RF CMOS app...
The presented paper deals with the reliability of a 1.0 µm CMOS-SOI-process which is intended for us...
Standard Bulk-CMOS-technology targets use-temperatures of not more than 175 °C. With Silicon-on-Insu...
This paper presents the latest results of our research on SOI (Silicon-On-Insulator) technology for ...
The silicon-on-insulator (SOI) CMOS technology is one of the best candidates for high-temperature ap...
The characteristics of enhancement-mode MOS transistors fabricated on zone-melting recrystallized (Z...
The purpose of this study was to design a Silicon-On-Insulator (SOI) CMOS band-gap voltage reference...
Microelectronic manufacturing progresses not only towards further miniaturisation, but also applicat...