Metal-Insulator-Metal capacitors, with ZrO2/Al2O 3/ZrO2 (ZAZ)-nanolaminate thin-films as a dielectric layer, exhibit reduced leakage currents compared to corresponding capacitors based on pure ZrO2 while maintaining a sufficiently high dielectric constant for the DRAM application. This work is a comparative study demonstrating how the incorporation of a small amount of Al is responsible for the suppression of crystallization during deposition. Extensive electrical characterization leads to the identification of a defect band which conductive atomic force microscopy shows to be formed along crystallite grain boundaries, extending through the entire ZrO2-film. The incorporation of a sub-layer of Al2O3 prevents these grain boundaries resulting...
Aiming for improvement of the ZrO2-based insulator properties as compared to the state-of-the-art Zr...
Embedded three-dimensional (3-D) metal-insulator-metal (MIM) decoupling capacitors with high-κ diele...
DRAM capacitors are reaching the scaling limit and new approaches are necessary to enable further re...
ZrO2-based metal-insulator-metal capacitors are used in various volatile and nonvolatile memory devi...
We report on the effects of post-deposition annealing on the electrical properties and the dielectri...
In this work, a metal-oxide-semiconductor capacitor with zirconium oxide (ZrO2) gate dielectric was ...
The high-kappa gate dielectrics, specifically amorphous films offer salient features such as excepti...
Leakage current distributions of high‐k dielectric thin films (8 nm HfSixOy and 5 nm ZrO2) were meas...
The deposition of alternating (sub)monolayers of lanthanum oxide (La2O3) and zirconium oxide (ZrO2) ...
Producción CientíficaThin mixed and nanolaminate films of ZrO2 and Al2O3 were grown by atomic layer ...
With the acceleration of the scaling down of integrated circuits, it has become very challenging to ...
Leakage currents through Al/ZrO2/SiO2/n-Si metal-insulator-semiconductor (MIS) capacitors were studi...
Thin mixed and nanolaminate films of ZrO2 and Al2O3 were grown by atomic layer deposition from the c...
In this paper, the material and electrical properties of ZrO2 in metal-insulator-metal (MIM) DRAM ca...
We investigated ZrO2-based new dielectric materials for random access memory by pulsed laser deposit...
Aiming for improvement of the ZrO2-based insulator properties as compared to the state-of-the-art Zr...
Embedded three-dimensional (3-D) metal-insulator-metal (MIM) decoupling capacitors with high-κ diele...
DRAM capacitors are reaching the scaling limit and new approaches are necessary to enable further re...
ZrO2-based metal-insulator-metal capacitors are used in various volatile and nonvolatile memory devi...
We report on the effects of post-deposition annealing on the electrical properties and the dielectri...
In this work, a metal-oxide-semiconductor capacitor with zirconium oxide (ZrO2) gate dielectric was ...
The high-kappa gate dielectrics, specifically amorphous films offer salient features such as excepti...
Leakage current distributions of high‐k dielectric thin films (8 nm HfSixOy and 5 nm ZrO2) were meas...
The deposition of alternating (sub)monolayers of lanthanum oxide (La2O3) and zirconium oxide (ZrO2) ...
Producción CientíficaThin mixed and nanolaminate films of ZrO2 and Al2O3 were grown by atomic layer ...
With the acceleration of the scaling down of integrated circuits, it has become very challenging to ...
Leakage currents through Al/ZrO2/SiO2/n-Si metal-insulator-semiconductor (MIS) capacitors were studi...
Thin mixed and nanolaminate films of ZrO2 and Al2O3 were grown by atomic layer deposition from the c...
In this paper, the material and electrical properties of ZrO2 in metal-insulator-metal (MIM) DRAM ca...
We investigated ZrO2-based new dielectric materials for random access memory by pulsed laser deposit...
Aiming for improvement of the ZrO2-based insulator properties as compared to the state-of-the-art Zr...
Embedded three-dimensional (3-D) metal-insulator-metal (MIM) decoupling capacitors with high-κ diele...
DRAM capacitors are reaching the scaling limit and new approaches are necessary to enable further re...