Entwicklung eines robusten, keramischen MEMS - Packaging als hermetisch dichtes und hoch-schockfestes SMD-Bauteil

The Low-Temperature Cofired Ceramic Technology (LTCC) based package shown here is an example of a specially customized surface mount device (SMD) solution following the requirements of a high-G acceleration sensor. The main focus was the development of an economically viable Packaging - solution. For achieving this goal attention was paid to the aspects of cost reduction by miniaturization and by the use of cost-effective materials. LTCC was chosen as the preferred manufacturing technology, because of the possibility to integrate electrical wiring inside the ceramic. Using this technology a ceramic packaging with gas-tight sealing, solderable SMD contacts and an electrically and mechanically stable solution could be developed and manufactured