In this paper a variability-aware compact modeling strategy is presented for 20-nm bulk planar technology, taking into account the critical dimension long-range process variation and local statistical variability. Process and device simulations and statistical simulations for a wide range of combinations of L and W are carefully carried out using a design of experiments approach. The variability aware compact model strategy features a comprehensively extracted nominal model and two groups of selected parameters for extractions of the long-range process variation and statistical variability. The unified variability compact modeling method can provide a simulation frame for variability aware technology circuit co-optimization
session 17: characterization, reliability and Yield - innovative characterizations (17-1)Internation...
session 17: characterization, reliability and Yield - innovative characterizations (17-1)Internation...
session 17: characterization, reliability and Yield - innovative characterizations (17-1)Internation...
This paper presents a hierarchical variability-aware compact model methodology based on a comprehens...
One of the major limiting factors of the CMOS device, circuit and system simulation in sub 100nm reg...
One of the major limiting factors of the CMOS device, circuit and system simulation in sub 100nm reg...
One of the major limiting factors of the CMOS device, circuit and system simulation in sub 100nm reg...
Process variability is a major challenge for the design of nano scale MOSFETs due to fundamental phy...
Statistical variability associated with discreteness of charge and granularity of matter is one of l...
It is widely recognized that in nano-scale CMOS technology variation in themanufacturing process has...
It is widely recognized that in nano-scale CMOS technology variation in themanufacturing process has...
In this paper, we present a FinFET-focused variability-aware compact model (CM) extraction and gener...
This paper presents a principal component analysis (PCA)-based unified compact modelling strategy ...
This paper presents a TCAD based design technology co-optimization (DTCO) process for 14nm SOI FinFE...
session 17: characterization, reliability and Yield - innovative characterizations (17-1)Internation...
session 17: characterization, reliability and Yield - innovative characterizations (17-1)Internation...
session 17: characterization, reliability and Yield - innovative characterizations (17-1)Internation...
session 17: characterization, reliability and Yield - innovative characterizations (17-1)Internation...
This paper presents a hierarchical variability-aware compact model methodology based on a comprehens...
One of the major limiting factors of the CMOS device, circuit and system simulation in sub 100nm reg...
One of the major limiting factors of the CMOS device, circuit and system simulation in sub 100nm reg...
One of the major limiting factors of the CMOS device, circuit and system simulation in sub 100nm reg...
Process variability is a major challenge for the design of nano scale MOSFETs due to fundamental phy...
Statistical variability associated with discreteness of charge and granularity of matter is one of l...
It is widely recognized that in nano-scale CMOS technology variation in themanufacturing process has...
It is widely recognized that in nano-scale CMOS technology variation in themanufacturing process has...
In this paper, we present a FinFET-focused variability-aware compact model (CM) extraction and gener...
This paper presents a principal component analysis (PCA)-based unified compact modelling strategy ...
This paper presents a TCAD based design technology co-optimization (DTCO) process for 14nm SOI FinFE...
session 17: characterization, reliability and Yield - innovative characterizations (17-1)Internation...
session 17: characterization, reliability and Yield - innovative characterizations (17-1)Internation...
session 17: characterization, reliability and Yield - innovative characterizations (17-1)Internation...
session 17: characterization, reliability and Yield - innovative characterizations (17-1)Internation...