A reflective contact layer system for an optoelectronic component (100) is specified, comprising: - a first p-doped nitride compound semiconductor layer (1), - a transparent conductive oxide layer (3), - a mirror layer (4), and - a second p-doped nitride compound semiconductor layer (2) arranged between the first p-doped nitride compound semiconductor layer (1) and the transparent conductive oxide layer (3), wherein the second p-doped nitride compound semiconductor layer (2) has N-face domains (22) at an interface (23) facing the transparent conductive oxide layer (3), and wherein the N-face domains (22) have an area proportion of at least 95 percent at the interface (23). Furthermore, a method for producing the contact layer system is spec...
Source: WO14202391A1 [EN] The invention relates to optical components which are formed as molded par...
WO 2008125278 A2 UPAB: 20081118 NOVELTY - The device has two optoelectronic components (102, 106) on...
WO 200219403 A UPAB: 20020704 NOVELTY - Production of a composite structure comprises preparing a gr...
An optical element comprising a reflective coating is specified, wherein the reflective coating comp...
EP 173643 A UPAB: 19930922 A semiconductor device, including a layer of optically transparent n-cond...
The system has a structured base layer (2) applied on a substrate (1), and including structures (21)...
EP 1273558 A UPAB: 20030303 NOVELTY - A heat reflecting layer system comprises an antireflection lay...
Heat insulating layer system for transparent substrate consists of one or more metallic reflection l...
DE 19838826 A UPAB: 20000516 NOVELTY - An optical component, with a transparent scratch-resistant co...
EP 1351258 A UPAB: 20031030 NOVELTY - Thicknesses of molybdenum and silicon layers are selected to l...
EP 1123906 A UPAB: 20011010 NOVELTY - Particle supply forming the blocking layer is controlled durin...
WO15063068A1 [EN] An electro-optical, organic semiconductor component comprises a photoactive layer ...
The invention relates to a method for producing a reflection-reducing layer system on a substrate (1...
DE 3724634 A UPAB: 19930923 The device contains electrodes (2) of optically transparent, e.g. 100 nm...
WO2005054928 A UPAB: 20050725 NOVELTY - The device has a spectrally selective reflective coating sys...
Source: WO14202391A1 [EN] The invention relates to optical components which are formed as molded par...
WO 2008125278 A2 UPAB: 20081118 NOVELTY - The device has two optoelectronic components (102, 106) on...
WO 200219403 A UPAB: 20020704 NOVELTY - Production of a composite structure comprises preparing a gr...
An optical element comprising a reflective coating is specified, wherein the reflective coating comp...
EP 173643 A UPAB: 19930922 A semiconductor device, including a layer of optically transparent n-cond...
The system has a structured base layer (2) applied on a substrate (1), and including structures (21)...
EP 1273558 A UPAB: 20030303 NOVELTY - A heat reflecting layer system comprises an antireflection lay...
Heat insulating layer system for transparent substrate consists of one or more metallic reflection l...
DE 19838826 A UPAB: 20000516 NOVELTY - An optical component, with a transparent scratch-resistant co...
EP 1351258 A UPAB: 20031030 NOVELTY - Thicknesses of molybdenum and silicon layers are selected to l...
EP 1123906 A UPAB: 20011010 NOVELTY - Particle supply forming the blocking layer is controlled durin...
WO15063068A1 [EN] An electro-optical, organic semiconductor component comprises a photoactive layer ...
The invention relates to a method for producing a reflection-reducing layer system on a substrate (1...
DE 3724634 A UPAB: 19930923 The device contains electrodes (2) of optically transparent, e.g. 100 nm...
WO2005054928 A UPAB: 20050725 NOVELTY - The device has a spectrally selective reflective coating sys...
Source: WO14202391A1 [EN] The invention relates to optical components which are formed as molded par...
WO 2008125278 A2 UPAB: 20081118 NOVELTY - The device has two optoelectronic components (102, 106) on...
WO 200219403 A UPAB: 20020704 NOVELTY - Production of a composite structure comprises preparing a gr...