Verfahren zur Ablation einer Schicht

The invention relates to a method for ablating at least one layer (13) from a substrate (10), wherein laser radiation (210) from at least one first laser (21) acts on at least a sub-area (105) of the surface of the layer (13), wherein the first laser (21) produces pulsed laser radiation (210) having a pulse duration less than approximately 50 ns and at least one second light source (22) is used, which produces pulsed laser radiation (220) having a pulse duration greater than approximately 1 ns or contains a continuous-wave laser or emits incoherent radiation, wherein the light (210) of the first laser (21) hits at a time at which at least the sub-area (105) of the surface is in thermal equilibrium with the surroundings