A thermo-mechanical wafer-to-wafer bonding process is studied through experiments on the glass frit material and thermo-mechanical numerical simulations to evaluate the effect of the residual stresses on the wafer warpage. To experimentally characterize the material, confocal laser profilometry and scanning electron microscopy for surface observation, energy dispersive X-ray spectroscopy for microstructural investigation, and nanoindentation and die shear tests for the evaluation of mechanical properties are used. An average effective Young’s modulus of 86.5 ± 9.5 GPa, a Poisson’s ratio of 0.19 ± 0.02, and a hardness of 5.26 ± 0.8 GPa were measured through nanoindentation for the glass frit material. The lowest nominal shear strength ranged...
In this paper, results of mechanical strength investigations for glass frit bonded components using ...
High reliability equipments are essential, especially in extreme environments. Extreme environment w...
The long-term mechanical stability of the wafer level package is an important aspect in the reliabil...
A thermo-mechanical wafer-to-wafer bonding process is studied through experiments on the glass frit ...
In the thermo-compressive, silicon-to-silicon wafer bonding process, due to the residual stresses, t...
Wafer bonding is a key technology in the manufacturing of microelectronic and micromechanical system...
Wafer bonding is a key technology in the manufacturing of micro electro mechanical systems (MEMS). I...
The glass frit layer in wafer-bonded MEMS is subjected to mechanical and thermo mechanical stresses ...
Thermocompression bonding of gold is a promising technique for the fabrication and packaging microel...
A geometrical modification on silicon wafers before the bonding process, aimed to decrease (1) the r...
Glass frit bonding is an important technology for the hermetical encapsulation of microsensors. Duri...
Thermocompression bonding joins substrates via a bonding layer. In this paper, silicon substrates we...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 20...
The mechanism of direct bonding at room temperature has been attributed to the short range inter-mol...
On industrial scale, glass frit bonding is widely used for assembly and encapsulation of MEMS. A key...
In this paper, results of mechanical strength investigations for glass frit bonded components using ...
High reliability equipments are essential, especially in extreme environments. Extreme environment w...
The long-term mechanical stability of the wafer level package is an important aspect in the reliabil...
A thermo-mechanical wafer-to-wafer bonding process is studied through experiments on the glass frit ...
In the thermo-compressive, silicon-to-silicon wafer bonding process, due to the residual stresses, t...
Wafer bonding is a key technology in the manufacturing of microelectronic and micromechanical system...
Wafer bonding is a key technology in the manufacturing of micro electro mechanical systems (MEMS). I...
The glass frit layer in wafer-bonded MEMS is subjected to mechanical and thermo mechanical stresses ...
Thermocompression bonding of gold is a promising technique for the fabrication and packaging microel...
A geometrical modification on silicon wafers before the bonding process, aimed to decrease (1) the r...
Glass frit bonding is an important technology for the hermetical encapsulation of microsensors. Duri...
Thermocompression bonding joins substrates via a bonding layer. In this paper, silicon substrates we...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 20...
The mechanism of direct bonding at room temperature has been attributed to the short range inter-mol...
On industrial scale, glass frit bonding is widely used for assembly and encapsulation of MEMS. A key...
In this paper, results of mechanical strength investigations for glass frit bonded components using ...
High reliability equipments are essential, especially in extreme environments. Extreme environment w...
The long-term mechanical stability of the wafer level package is an important aspect in the reliabil...