Add to ORKGUS2014339658A [EN] The invention relates to an MEMS structure with a stack made of different layers and a spring-and-mass system varying in its thickness which is formed of the stack, and wherein, starting from a back side of the stack and the substrate, at laterally different positions, the substrate while leaving the first semiconductor layer, or the substrate, the first etch-stop layer and the first semiconductor layer are removed, and to a method for manufacturing such a structure
WO 2009036969 A1 UPAB: 20090409 NOVELTY - The method involves providing an integrated circuit struct...
A micromechanical relay production process involves: (a) applying a sacrificial layer (26) onto a su...
WO 2007025519 A2 UPAB: 20070504 NOVELTY - Producing an embossed structure on a substrate comprises p...
US 20080241462 A1 UPAB: 20081024 NOVELTY - A deflectable structure (100) has a layer (102) e.g. a pl...
A MEMS comprises a stack comprising a first layer and a second layer having sides facing each other....
In order to produce a micromechanical surface structure, a sacrificial layer is applied to a substra...
WO 200036385 A UPAB: 20000811 NOVELTY - Micromechanical structure production involves bonding a firs...
DE 102008060796 A1 UPAB: 20100604 NOVELTY - The method involves coating the surface of a projection ...
US 20090303563 A1 UPAB: 20100101 NOVELTY - An intermediate layer (130) is formed between the carrier...
Embodiments of the invention relate to production methods. In a first step, a semiconductor substrat...
DE 102007006640 A1 UPAB: 20080903 NOVELTY - The method involves partially covering a surface of a se...
The present publication discloses a micromechanical structure including at least one active element,...
WO 2007025753 A2 UPAB: 20070629 NOVELTY - The method involves producing two functional layers (12a-1...
DE 10300577 A UPAB: 20040818 NOVELTY - The production of a semiconductor vertical and lateral power ...
The description refers to a micromechanical component comprising a substrate and a flat deformable e...
WO 2009036969 A1 UPAB: 20090409 NOVELTY - The method involves providing an integrated circuit struct...
A micromechanical relay production process involves: (a) applying a sacrificial layer (26) onto a su...
WO 2007025519 A2 UPAB: 20070504 NOVELTY - Producing an embossed structure on a substrate comprises p...
US 20080241462 A1 UPAB: 20081024 NOVELTY - A deflectable structure (100) has a layer (102) e.g. a pl...
A MEMS comprises a stack comprising a first layer and a second layer having sides facing each other....
In order to produce a micromechanical surface structure, a sacrificial layer is applied to a substra...
WO 200036385 A UPAB: 20000811 NOVELTY - Micromechanical structure production involves bonding a firs...
DE 102008060796 A1 UPAB: 20100604 NOVELTY - The method involves coating the surface of a projection ...
US 20090303563 A1 UPAB: 20100101 NOVELTY - An intermediate layer (130) is formed between the carrier...
Embodiments of the invention relate to production methods. In a first step, a semiconductor substrat...
DE 102007006640 A1 UPAB: 20080903 NOVELTY - The method involves partially covering a surface of a se...
The present publication discloses a micromechanical structure including at least one active element,...
WO 2007025753 A2 UPAB: 20070629 NOVELTY - The method involves producing two functional layers (12a-1...
DE 10300577 A UPAB: 20040818 NOVELTY - The production of a semiconductor vertical and lateral power ...
The description refers to a micromechanical component comprising a substrate and a flat deformable e...
WO 2009036969 A1 UPAB: 20090409 NOVELTY - The method involves providing an integrated circuit struct...
A micromechanical relay production process involves: (a) applying a sacrificial layer (26) onto a su...
WO 2007025519 A2 UPAB: 20070504 NOVELTY - Producing an embossed structure on a substrate comprises p...