The laser welding of two fused silica substrates using a fresnoitic glass thin film as a sealant by irradiation with a ns laser is studied. Two different laser parameter sets were compared in terms of bond quality, which include two different laser beam trajectories: linear and wobble (circular) trajectory. The composition of the glass sealant changes with the course of the laser welding, incorporating silica from the substrates. After joining, the bonded samples were exposed to UV light and a very intense emission in the blue spectral range is observed by naked eye, which is due to the crystallization of the fresnoite glass upon the laser irradiation. EDX analysis confirms the crystallization of fresnoite, together with a great enrichment ...
A novel method for joining silicon and glass wafers with laser radiation is described. In order to c...
We report on the welding of fused silica with bursts of ultrashort laser pulses. By optimizing the b...
A novel method for bonding micro optical components using a new joining process of silicon with glas...
Laser welding of dissimilar materials is challenging, due to their difference in coefficients of the...
Two sapphire substrates are tightly bonded through a fresnoite-glass thin film, by irradiation with ...
This paper embraces two different approaches for the joining of materials through glass sealants. Fi...
This work reports on laser welding of two 1 mm thickness borosilicate glasses through the irradiatio...
Two sapphire substrates were bonded using a fresnoite glass thin film as a sealant, by irradiation w...
New joining techniques are required for the variety of materials used in the manufacture of microsys...
We report on the joining of different glass types with dissimilar optical, thermal and mechanical pr...
We report on the welding of various glasses with ultrashort laser pulses. Femtosecond laser pulses a...
The welding of transparent materials with ultrashort laser pulse at high repetition rates has attrac...
The realization of stable bonds between different glasses has attracted a lot interest in recent yea...
The direct wafer bonding technology is applied to join glass substrates for optical devices in high ...
Devices consisting of glass and metal are widely applied to many fields. With the miniaturisation an...
A novel method for joining silicon and glass wafers with laser radiation is described. In order to c...
We report on the welding of fused silica with bursts of ultrashort laser pulses. By optimizing the b...
A novel method for bonding micro optical components using a new joining process of silicon with glas...
Laser welding of dissimilar materials is challenging, due to their difference in coefficients of the...
Two sapphire substrates are tightly bonded through a fresnoite-glass thin film, by irradiation with ...
This paper embraces two different approaches for the joining of materials through glass sealants. Fi...
This work reports on laser welding of two 1 mm thickness borosilicate glasses through the irradiatio...
Two sapphire substrates were bonded using a fresnoite glass thin film as a sealant, by irradiation w...
New joining techniques are required for the variety of materials used in the manufacture of microsys...
We report on the joining of different glass types with dissimilar optical, thermal and mechanical pr...
We report on the welding of various glasses with ultrashort laser pulses. Femtosecond laser pulses a...
The welding of transparent materials with ultrashort laser pulse at high repetition rates has attrac...
The realization of stable bonds between different glasses has attracted a lot interest in recent yea...
The direct wafer bonding technology is applied to join glass substrates for optical devices in high ...
Devices consisting of glass and metal are widely applied to many fields. With the miniaturisation an...
A novel method for joining silicon and glass wafers with laser radiation is described. In order to c...
We report on the welding of fused silica with bursts of ultrashort laser pulses. By optimizing the b...
A novel method for bonding micro optical components using a new joining process of silicon with glas...