At Philips Research Laboratories a silicon compiler for digital signal processor applications has been developed. It generates hierarchical IC designs composed of functional building blocks. The ICs are tested following the macro test strategy. Each building block has its own test plan; a procedure to access it for test purposes. To save bonding pads the control signals for the tests can be generated by an on-chip Test Control Block (TCB). Both the TCB and the test plans for the building blocks can be represented by finite state machines. This report presents a method to merge the test plans of the building blocks into one minimal finite state machine, in order to minimize silicon area overhead caused by the TCB. This merging is found to in...
The goal of the research project that is presented in this paper, is the development of a mixed anal...
Today it is possible to integrate more than one billion transistors onto a single chip. This has ena...
The rapid shrinking of the technology node from deep submicron levels to 90nm and below has allowed ...
Linear digital signal processors, commonly implemented using silicon compilers in bit-serial archite...
The IC production process contains uncertainties by nature. Therefore, every IC should undergo a str...
© 2015 IEEE. In this paper a method is presented to address the automatic testing of analog ICs. Bas...
Deals with a design for testability strategy for the SYCO control section compiler developed in the ...
This paper describes a design-for-testability expert system for the selection of the most appropriat...
The paper addresses the issue of microprocessor and microcontroller testing, and follows an approach...
This paper deals with control-aware test architecture design for SOCs. The term test control refers ...
This project deals with the design of an autonomous microprocessor controlled testing unit for autom...
Includes bibliographical references (page 91)This project presents a Microprocessor System for Autom...
Progress in digital technology has yielded continuing growth in the complexity of circuits that can ...
With the growing size of modern integrated circuit designs, automated design tools have taken an imp...
This chapter describes and analyzes a methodology for gathering together test-programs for microproc...
The goal of the research project that is presented in this paper, is the development of a mixed anal...
Today it is possible to integrate more than one billion transistors onto a single chip. This has ena...
The rapid shrinking of the technology node from deep submicron levels to 90nm and below has allowed ...
Linear digital signal processors, commonly implemented using silicon compilers in bit-serial archite...
The IC production process contains uncertainties by nature. Therefore, every IC should undergo a str...
© 2015 IEEE. In this paper a method is presented to address the automatic testing of analog ICs. Bas...
Deals with a design for testability strategy for the SYCO control section compiler developed in the ...
This paper describes a design-for-testability expert system for the selection of the most appropriat...
The paper addresses the issue of microprocessor and microcontroller testing, and follows an approach...
This paper deals with control-aware test architecture design for SOCs. The term test control refers ...
This project deals with the design of an autonomous microprocessor controlled testing unit for autom...
Includes bibliographical references (page 91)This project presents a Microprocessor System for Autom...
Progress in digital technology has yielded continuing growth in the complexity of circuits that can ...
With the growing size of modern integrated circuit designs, automated design tools have taken an imp...
This chapter describes and analyzes a methodology for gathering together test-programs for microproc...
The goal of the research project that is presented in this paper, is the development of a mixed anal...
Today it is possible to integrate more than one billion transistors onto a single chip. This has ena...
The rapid shrinking of the technology node from deep submicron levels to 90nm and below has allowed ...