Influence of crystalline defects on nitrogen implantation in copper for surface hardening

International audienceThe design of electrical contacts that combine a high electrical conductivity and excellent wear resistance requires the optimization of surface processing. Surface hardening of copper was achieved by nitrogen implantation and the underlying mechanisms were investigated by electron microscopy. Pure copper and a CuSn alloy were implanted with nitrogen in the recrystallized state and after severe plastic deformation. The larger lattice parameter of CuS