A new one-dimensional thermal network modeling approach is proposed that can accurately predict transient/dynamic temperature distribution of passive cooling systems. The present model has applications in a variety of electronic and power electronic systems. The main components of any passive cooling solution are heat spreaders, heat pipes, and heat sinks as well as thermal boundary conditions such as natural convection and radiation heat transfer. In the present approach, all the above-mentioned components are analyzed, analytically modeled and presented in the form of resistance and capacitance (RC) network blocks. The proposed RC model is capable of predicting the transient/dynamic as well as steady state thermal behavior of the targeted...
A Thermal management simulation tool is required to rapidly and accurately evaluates and mitigates t...
Although stationary models for thermal circuits have been widely used, a direct analogy of transient...
With the ever increasing integration density of electronic circuits and devices thermal issues due t...
Cooling as well as heating circuits can be modeled as a network of elements that obey mass, momentum...
Electronics cooling, although subject of studies since the first semiconductor devices dawn, are sti...
This work proposes analytical thermal models for through-PCB thermal vias and passive heat-sinks, tw...
The removal of heat from electronic components, increasingly miniaturized with high power dissipatio...
Existing passive cooling solutions limit the short-term thermal output of systems, thereby either li...
One of the optimal control methods of Heating, Ventilation, and Air Conditioning (HVAC) systems for ...
This paper presents a numerical investigation of the thermal performance of a heat sink augmented wi...
Flat panel displays are conventionally cooled by internal natural convection, which constrains the p...
The use of direct drives in linear and rotary axes as well as increased power density of main drives...
Cooling as well as heating circuits can be modeled as a network of elements that obey mass, momentum...
As the power density and switching frequency increase, thermal analysis of power electronics system ...
The thermal management and determination of maximum allowable switching frequency are two important ...
A Thermal management simulation tool is required to rapidly and accurately evaluates and mitigates t...
Although stationary models for thermal circuits have been widely used, a direct analogy of transient...
With the ever increasing integration density of electronic circuits and devices thermal issues due t...
Cooling as well as heating circuits can be modeled as a network of elements that obey mass, momentum...
Electronics cooling, although subject of studies since the first semiconductor devices dawn, are sti...
This work proposes analytical thermal models for through-PCB thermal vias and passive heat-sinks, tw...
The removal of heat from electronic components, increasingly miniaturized with high power dissipatio...
Existing passive cooling solutions limit the short-term thermal output of systems, thereby either li...
One of the optimal control methods of Heating, Ventilation, and Air Conditioning (HVAC) systems for ...
This paper presents a numerical investigation of the thermal performance of a heat sink augmented wi...
Flat panel displays are conventionally cooled by internal natural convection, which constrains the p...
The use of direct drives in linear and rotary axes as well as increased power density of main drives...
Cooling as well as heating circuits can be modeled as a network of elements that obey mass, momentum...
As the power density and switching frequency increase, thermal analysis of power electronics system ...
The thermal management and determination of maximum allowable switching frequency are two important ...
A Thermal management simulation tool is required to rapidly and accurately evaluates and mitigates t...
Although stationary models for thermal circuits have been widely used, a direct analogy of transient...
With the ever increasing integration density of electronic circuits and devices thermal issues due t...