We present an ultrasonic device with the ability to locally remove deposited layers from a glass slide in a controlled and rapid manner. The cleaning takes place as the result of cavitating bubbles near the deposited layers and not due to acoustic streaming. The bubbles are ejected from air-filled cavities micromachined in a silicon surface, which, when vibrated ultrasonically at a frequency of 200 kHz, generate a stream of bubbles that travel to the layer deposited on an opposing glass slide. Depending on the pressure amplitude, the bubble clouds ejected from the micropits attain different shapes as a result of complex bubble interaction forces, leading to distinct shapes of the cleaned areas. We have determined the removal rates for sever...
This paper described the experimental studies on the de-fouling mechanism of acoustic cavitation bub...
The presence of acoustic cavitation in the cleaning liquid is a crucial precondition for cleaning ac...
Megasonic cleaning as applied in leading edge semiconductor device manufacturing strongly relies on ...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
Within the last decade, the semiconductor industry has overstepped the frontier between micro- and n...
Merely the presence of compressible entities, known as bubbles, greatly enriches the physical phenom...
This thesis shows that through microfabrication techniques, an improved efficiency of sono-reactors ...
This thesis shows that through microfabrication techniques, an improved efficiency of sono-reactors ...
Acoustic cavitation in a liquid medium generates several physical and chemical effects. The oscillat...
Over the years, megasonic energy has been widely used in the semiconductor industry for effective pa...
This paper described the experimental studies on the de-fouling mechanism of acoustic cavitation bub...
This paper described the experimental studies on the de-fouling mechanism of acoustic cavitation bub...
The presence of acoustic cavitation in the cleaning liquid is a crucial precondition for cleaning ac...
Megasonic cleaning as applied in leading edge semiconductor device manufacturing strongly relies on ...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
We present an ultrasonic device with the ability to locally remove deposited layers from a glass sli...
Within the last decade, the semiconductor industry has overstepped the frontier between micro- and n...
Merely the presence of compressible entities, known as bubbles, greatly enriches the physical phenom...
This thesis shows that through microfabrication techniques, an improved efficiency of sono-reactors ...
This thesis shows that through microfabrication techniques, an improved efficiency of sono-reactors ...
Acoustic cavitation in a liquid medium generates several physical and chemical effects. The oscillat...
Over the years, megasonic energy has been widely used in the semiconductor industry for effective pa...
This paper described the experimental studies on the de-fouling mechanism of acoustic cavitation bub...
This paper described the experimental studies on the de-fouling mechanism of acoustic cavitation bub...
The presence of acoustic cavitation in the cleaning liquid is a crucial precondition for cleaning ac...
Megasonic cleaning as applied in leading edge semiconductor device manufacturing strongly relies on ...