Add to ORKGThis article presents a mathematical theory for component placement for reliability based on the thermal response of conductively cooled printed wiring board. Placement procedures based on the theory are then developed and a general placement methodology is discussed
This report is a review of the cooperative: Westinghouse University of Maryland, Mechanical Engineer...
There has been a rapid development of electronic devices and competition among the elec-tronic compa...
Copyright © 2013 Yasushi Koito, et al. This is an open access article distributed under the Creative...
This paper investigates the extent to which the thermal reliability of components as a function of t...
The placement of components on a printed wiring board (PWB) affects reliability, manufacturability, ...
This article discusses the optimum placement of a single row of convectively cooled electronic compo...
ABSTRACT Boards made of composites are susceptible of structural failure or irreversible damage unde...
Background. Printed circuit boards of modern analog, digital and digital-analog electronic devices o...
Several factors such as copper density, number of copper layers, surface properties, connectors, etc...
Power density in modern integrated circuits (ICs) continues to increase at an alarming rate. In turn...
International audienceThe thermal fatigue of vias in rigid-flex printed circuit boards (PCB) is cons...
Higher integration and reduced dimensions of components and printed circuit boards lead to rise of d...
The solder joint reliability of ceramic chip resistors assembled to laminate substrates has been a l...
This dissertation is regarding the fuzzy-thermal method for the placement of electronic components o...
This paper will present the research results for reliability of two embedding technologies in compar...
This report is a review of the cooperative: Westinghouse University of Maryland, Mechanical Engineer...
There has been a rapid development of electronic devices and competition among the elec-tronic compa...
Copyright © 2013 Yasushi Koito, et al. This is an open access article distributed under the Creative...
This paper investigates the extent to which the thermal reliability of components as a function of t...
The placement of components on a printed wiring board (PWB) affects reliability, manufacturability, ...
This article discusses the optimum placement of a single row of convectively cooled electronic compo...
ABSTRACT Boards made of composites are susceptible of structural failure or irreversible damage unde...
Background. Printed circuit boards of modern analog, digital and digital-analog electronic devices o...
Several factors such as copper density, number of copper layers, surface properties, connectors, etc...
Power density in modern integrated circuits (ICs) continues to increase at an alarming rate. In turn...
International audienceThe thermal fatigue of vias in rigid-flex printed circuit boards (PCB) is cons...
Higher integration and reduced dimensions of components and printed circuit boards lead to rise of d...
The solder joint reliability of ceramic chip resistors assembled to laminate substrates has been a l...
This dissertation is regarding the fuzzy-thermal method for the placement of electronic components o...
This paper will present the research results for reliability of two embedding technologies in compar...
This report is a review of the cooperative: Westinghouse University of Maryland, Mechanical Engineer...
There has been a rapid development of electronic devices and competition among the elec-tronic compa...
Copyright © 2013 Yasushi Koito, et al. This is an open access article distributed under the Creative...