The effect of process-induced voids on the durability of Sn-Pb and Pb-free solder interconnects in electronic products is not clearly understood and researchers have reported conflicting findings. Studies have shown that depending on the size and location, voids are not always detrimental to reliability, and in fact, may sometimes even increase the durability of joints. This debate is more intensified in Pb-free solders; since voids are more common in Pb-free joints. Results of experimental studies are presented in this study to empirically explore the influence of voids on the durability of Ball Grid Array (BGA) Pb-free solder joints. In order to quantify the detailed influence of size, location, and volume fraction of voids, extensi...
Crystallographically-facetted void (CFV) formation in lead-free solder-joints has been observed afte...
The mechanics of failure in a solder joint under cyclic mechanical loading is quantified and describ...
This study examines the reliability of solder joints with voids under thermo mechanical loading. Non...
After lead-free technology, pre-existing voids in Power-MOSFET device solder connections have been a...
© 2011-2012 IEEE. This paper demonstrates to what extent the number of thermal cycles affects the me...
The electronics industry strives for miniaturization and diversification of functionality while the ...
Abstract In this article, the effect of voids on thermomechanically-induced failure in the lead-fre...
To make the light-emitting diode (LED) more compact and effective, the flip chip solder joint is rec...
This paper presents the first part of a comprehensive mechanics approach capable of predicting the i...
The European Union Waste Electrical and Electronic Equipment Directive (WEEE) and Restriction of Haz...
In Microelectronic and MEMS (Micro-Electro-Mechanical Systems) applications the volume of solder joi...
Solder joints play a critical role in electronic devices by providing electrical, mechanical and the...
The ever increasing amount of electronic waste, most of which ends up in landfills, has become a ser...
The main goal of this paper is to shed light on the effect of strain rate and viscoplastic deformati...
The mechanics of failure in a solder joint under cyclic mechanical loading is quantified and describ...
Crystallographically-facetted void (CFV) formation in lead-free solder-joints has been observed afte...
The mechanics of failure in a solder joint under cyclic mechanical loading is quantified and describ...
This study examines the reliability of solder joints with voids under thermo mechanical loading. Non...
After lead-free technology, pre-existing voids in Power-MOSFET device solder connections have been a...
© 2011-2012 IEEE. This paper demonstrates to what extent the number of thermal cycles affects the me...
The electronics industry strives for miniaturization and diversification of functionality while the ...
Abstract In this article, the effect of voids on thermomechanically-induced failure in the lead-fre...
To make the light-emitting diode (LED) more compact and effective, the flip chip solder joint is rec...
This paper presents the first part of a comprehensive mechanics approach capable of predicting the i...
The European Union Waste Electrical and Electronic Equipment Directive (WEEE) and Restriction of Haz...
In Microelectronic and MEMS (Micro-Electro-Mechanical Systems) applications the volume of solder joi...
Solder joints play a critical role in electronic devices by providing electrical, mechanical and the...
The ever increasing amount of electronic waste, most of which ends up in landfills, has become a ser...
The main goal of this paper is to shed light on the effect of strain rate and viscoplastic deformati...
The mechanics of failure in a solder joint under cyclic mechanical loading is quantified and describ...
Crystallographically-facetted void (CFV) formation in lead-free solder-joints has been observed afte...
The mechanics of failure in a solder joint under cyclic mechanical loading is quantified and describ...
This study examines the reliability of solder joints with voids under thermo mechanical loading. Non...