International audienceThe present work introduces a simple and rapid process for the fabrication of MEMS resonators with electrostaticactuation and capacitive detection. Gold thermocompression is used to anchor the free-standing structure, provideelectrical connections and seal the chip to protect the structure to be released during wet etching, in a single step. Theadditional advantage of this process is the ability to simply adjust the gap of the parallel-plate capacitor through thethickness of electroplated gold. Squeeze damping is reduced by fabricating devices with increasing gaps
Absfrucf- We present an all-aluminum MEMS process (Al-MEMS) for the fabrication of large-gap electro...
partially released from the substrate where they are deposited. A new process, combining screenprint...
Microelectromechanical systems (MEMS) are ubiquitous. Scalable large-area ar-rays of MEMS on a varie...
International audienceThe present work introduces a simple and rapid process for the fabrication of ...
International audienceWe present a new type of acoustic resonator technology aimed to undoing the te...
A trench isolation technology employs trenches refilled with dielectric material to create, in a sin...
A micro-electro-mechanical system (MEMS) capacitive resonator and methods for manufacturing the same...
A MEMS electrostatically actuated resonator with fixed-fixed and fixed-free cantilever beams is desi...
This paper presents a MEMS fabrication technique for reducing the trench width of microstructures be...
In 3D integration components are sacked on each other by flip chip bonding. For gold-gold thermo-com...
A micro-electromechanical resonator includes an electrically-trimmed resonator body having at least ...
In this work, we use the micro-masonry technique to fabricate nanoplate resonators with integrated e...
International audienceIn this work, we use the micro-masonry technique to fabricate nanoplate resona...
Copper thermocompression is a promising wafer-level packaging technique, as it allows the bonding of...
this paper uses a similar commercial surface micromachining process [3] to create large parallel pla...
Absfrucf- We present an all-aluminum MEMS process (Al-MEMS) for the fabrication of large-gap electro...
partially released from the substrate where they are deposited. A new process, combining screenprint...
Microelectromechanical systems (MEMS) are ubiquitous. Scalable large-area ar-rays of MEMS on a varie...
International audienceThe present work introduces a simple and rapid process for the fabrication of ...
International audienceWe present a new type of acoustic resonator technology aimed to undoing the te...
A trench isolation technology employs trenches refilled with dielectric material to create, in a sin...
A micro-electro-mechanical system (MEMS) capacitive resonator and methods for manufacturing the same...
A MEMS electrostatically actuated resonator with fixed-fixed and fixed-free cantilever beams is desi...
This paper presents a MEMS fabrication technique for reducing the trench width of microstructures be...
In 3D integration components are sacked on each other by flip chip bonding. For gold-gold thermo-com...
A micro-electromechanical resonator includes an electrically-trimmed resonator body having at least ...
In this work, we use the micro-masonry technique to fabricate nanoplate resonators with integrated e...
International audienceIn this work, we use the micro-masonry technique to fabricate nanoplate resona...
Copper thermocompression is a promising wafer-level packaging technique, as it allows the bonding of...
this paper uses a similar commercial surface micromachining process [3] to create large parallel pla...
Absfrucf- We present an all-aluminum MEMS process (Al-MEMS) for the fabrication of large-gap electro...
partially released from the substrate where they are deposited. A new process, combining screenprint...
Microelectromechanical systems (MEMS) are ubiquitous. Scalable large-area ar-rays of MEMS on a varie...
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