The impact of self-interstitials and strain on the critical size for nucleation of incoherent precipitates is well-known. A factor that has been neglected so far is the incorporation of intrinsic point defects of the host matrix in the precipitate itself. It is shown that this can have an important impact both on the critical r size and on the precipitated phase. The theoretical results are illustrated for the case of oxygen precipitation in silicon. The growing precipitate can also cause the nucleation of extended lattice defects such as dislocations and stacking faults in the surrounding matrix. A model is presented to predict stacking fault r nucleation
Selected results from a TEM study of copper precipitation at extended surface defects in silicon are...
Abstract — An atomistic model for self-interstitial extended defects is presented in this work. Usin...
We report a study of the behavior of dislocations at oxide precipitates in (001) Czochralski silicon...
The impact of self-interstitials and strain on the critical size for nucleation of incoherent precip...
The formation of stacking faults (SF) at incoherent precipitates is modelled assuming that the SF fo...
square pits at sites of defects in crystals of the two orientations upon preferent ia l etching. Sum...
The impact of oxygen precipitates and dislocations on carrier recombination is investigated on thick...
The vast majority of modern microelectronic devices are fabricated on single-crystal silicon wafers,...
Most microelectronic devices are fabricated on single crystalline silicon substrates that are grown ...
Density spectra of grown-in oxide precipitate nuclei were measured along the radius of a silicon waf...
An oxygen precipitation/surface stacking-fault growth experiment has been carried out to determine t...
We investigated the interaction of intrinsic and extrinsic point defects with stacking faults in sil...
The influence of vacancy concentration on oxygen nucleation/precipitation kinetics in CZ silicon has...
none3The interaction between dislocations and impurities in silicon has been the subject of many st...
Gettering is defined as a process by which metal impurities in the device region are reduced by loca...
Selected results from a TEM study of copper precipitation at extended surface defects in silicon are...
Abstract — An atomistic model for self-interstitial extended defects is presented in this work. Usin...
We report a study of the behavior of dislocations at oxide precipitates in (001) Czochralski silicon...
The impact of self-interstitials and strain on the critical size for nucleation of incoherent precip...
The formation of stacking faults (SF) at incoherent precipitates is modelled assuming that the SF fo...
square pits at sites of defects in crystals of the two orientations upon preferent ia l etching. Sum...
The impact of oxygen precipitates and dislocations on carrier recombination is investigated on thick...
The vast majority of modern microelectronic devices are fabricated on single-crystal silicon wafers,...
Most microelectronic devices are fabricated on single crystalline silicon substrates that are grown ...
Density spectra of grown-in oxide precipitate nuclei were measured along the radius of a silicon waf...
An oxygen precipitation/surface stacking-fault growth experiment has been carried out to determine t...
We investigated the interaction of intrinsic and extrinsic point defects with stacking faults in sil...
The influence of vacancy concentration on oxygen nucleation/precipitation kinetics in CZ silicon has...
none3The interaction between dislocations and impurities in silicon has been the subject of many st...
Gettering is defined as a process by which metal impurities in the device region are reduced by loca...
Selected results from a TEM study of copper precipitation at extended surface defects in silicon are...
Abstract — An atomistic model for self-interstitial extended defects is presented in this work. Usin...
We report a study of the behavior of dislocations at oxide precipitates in (001) Czochralski silicon...