The formation of stacking faults (SF) at incoherent precipitates is modelled assuming that the SF formation is triggered by a sudden release of strain accumulated in the precipitate during its thermal history. This strain release occurs by emission of intrinsic point defects and leads to a high local supersaturation of intrinsic point defects that condense into a circular SF nucleus by the Bardeen-Herring mechanism. Expressions are derived allowing to calculate the critical precipitate size leading to SF formation as well as the size of the associated SF nucleus. The theoretical results are illustrated for silicon oxide precipitates in silicon and compared with experimental data
Non destructive techniques like scanning infrared microscopy and light beam induced current mapping...
This thesis describes a study on oxidation induced stacking faults (OSF's) in silicon and the effect...
The vast majority of modern microelectronic devices are fabricated on single-crystal silicon wafers,...
The formation of stacking faults (SF) at incoherent precipitates is modelled assuming that the SF fo...
The impact of self-interstitials and strain on the critical size for nucleation of incoherent precip...
Density spectra of grown-in oxide precipitate nuclei were measured along the radius of a silicon waf...
A general relation for the growth and retrogrowth of oxidation-induced stacking faults (OSF) has bee...
A model for the relation between density and length of oxidation-induced stacking faults on damaged ...
Most microelectronic devices are fabricated on single crystalline silicon substrates that are grown ...
square pits at sites of defects in crystals of the two orientations upon preferent ia l etching. Sum...
The vast majority of modern microelectronic devices are fabricated on single-crystal silicon wafers,...
Sacrificial thermal oxidation of standard SIMOX is currently the main route to form ultra thin film ...
The ring diameter of ring-like distributed oxidation induced stacking faults (OSF) in Czochralski gr...
The stacking faults grown into silicon during thermal oxidation were shrunk by high temperature heat...
An oxygen precipitation/surface stacking-fault growth experiment has been carried out to determine t...
Non destructive techniques like scanning infrared microscopy and light beam induced current mapping...
This thesis describes a study on oxidation induced stacking faults (OSF's) in silicon and the effect...
The vast majority of modern microelectronic devices are fabricated on single-crystal silicon wafers,...
The formation of stacking faults (SF) at incoherent precipitates is modelled assuming that the SF fo...
The impact of self-interstitials and strain on the critical size for nucleation of incoherent precip...
Density spectra of grown-in oxide precipitate nuclei were measured along the radius of a silicon waf...
A general relation for the growth and retrogrowth of oxidation-induced stacking faults (OSF) has bee...
A model for the relation between density and length of oxidation-induced stacking faults on damaged ...
Most microelectronic devices are fabricated on single crystalline silicon substrates that are grown ...
square pits at sites of defects in crystals of the two orientations upon preferent ia l etching. Sum...
The vast majority of modern microelectronic devices are fabricated on single-crystal silicon wafers,...
Sacrificial thermal oxidation of standard SIMOX is currently the main route to form ultra thin film ...
The ring diameter of ring-like distributed oxidation induced stacking faults (OSF) in Czochralski gr...
The stacking faults grown into silicon during thermal oxidation were shrunk by high temperature heat...
An oxygen precipitation/surface stacking-fault growth experiment has been carried out to determine t...
Non destructive techniques like scanning infrared microscopy and light beam induced current mapping...
This thesis describes a study on oxidation induced stacking faults (OSF's) in silicon and the effect...
The vast majority of modern microelectronic devices are fabricated on single-crystal silicon wafers,...