To achieve a higher I/O count, increased speed along with increased performance, the flip-chip technique is one of the driving forces. Although flip-chip results in very reliable connections with high electrical performance, the high cost level must be reduced. Therefore it is essential to use a low cost bumping technique for both chip and interconnection substitute (Cu metallisation). The first part of this paper deals with a novel bumping technology for single chips, whereas the second part focuses on the development of a straight-wall bumping process on Cu bond pads. As conventional Al bonding pads on IC chips are not solderable, an under-bump-metallisation (UBM) is required for reflow, soldering. Electroless nickel/immersion gold (e-Ni/...
Electroless nickel has been used for many decades to provide a hard, corrosion resistant surface fin...
For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto ...
For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto ...
To achieve a higher I/O count, increased speed along with increased performance, the flip-chip techn...
Flip-chip technology is a driving force in achieving increased speed and performance along with high...
A driving force to achieve increased speed and performance along with higher I/O count is the Flip C...
Flip Chip (FC) Technology is gaining an increased level of importance for a variety of applications ...
A driving force to achieve increased speed and performance along with higher I/O count is the Flip C...
Flip chip technology is a key driver for new complex system architectures and high-density packaging...
Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin co...
Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin co...
In this work, we describe the concepts and results of electroless plating techniques on silicon wafe...
Flip-chip bonding is a key packaging technology to achieve the smallest form factor possible. Using ...
The continuous trend of microelectronics packaging industry for further miniaturization of electroni...
For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto ...
Electroless nickel has been used for many decades to provide a hard, corrosion resistant surface fin...
For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto ...
For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto ...
To achieve a higher I/O count, increased speed along with increased performance, the flip-chip techn...
Flip-chip technology is a driving force in achieving increased speed and performance along with high...
A driving force to achieve increased speed and performance along with higher I/O count is the Flip C...
Flip Chip (FC) Technology is gaining an increased level of importance for a variety of applications ...
A driving force to achieve increased speed and performance along with higher I/O count is the Flip C...
Flip chip technology is a key driver for new complex system architectures and high-density packaging...
Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin co...
Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin co...
In this work, we describe the concepts and results of electroless plating techniques on silicon wafe...
Flip-chip bonding is a key packaging technology to achieve the smallest form factor possible. Using ...
The continuous trend of microelectronics packaging industry for further miniaturization of electroni...
For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto ...
Electroless nickel has been used for many decades to provide a hard, corrosion resistant surface fin...
For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto ...
For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto ...