The four dimensional parameter space (discharge voltage and current and reactive gas flow and pressure) related to a reactive Ar/O2 DC magnetron discharge with an aluminum target and constant pumping speed was acquired by measuring current-voltage characteristics at different oxygen flows. The projection onto the pressure-flow plane allows us to study the well-known S-shaped process curve. This experimental procedure guarantees no time dependent effects on the result. The obtained process curve appears not to be unique but rather two significantly different S-shaped curves are noticed which depend on the history of the steady state target condition. As such, this result has not only an important impact on the fundamental description of the ...
This paper discusses a few mechanisms that can assist to answer the title question. The initial appr...
AbstractIn this paper, the so-called Berg's model was successfully employed in order to model the re...
In the further development of reactive sputter deposition, strategies which allow for stabilization ...
The four dimensional parameter space (discharge voltage and current and reactive gas flow and pressu...
When process parameters such as the reactive gas partial pressure or the discharge voltage are studi...
The complexity of the reactive magnetron sputtering process is demonstrated by four simulation examp...
The complexity of the reactive magnetron sputtering process is demonstrated by four simulation examp...
An improved theoretical understanding of the reactive magnetron sputtering process is mandatory for ...
Reactive magnetron sputtering is a well-established physical vapor technique to deposit thin compoun...
Reactive magnetron sputtering is a well-established physical vapor technique to deposit thin compoun...
Reactive magnetron sputtering is a well-established physical vapor technique to deposit thin compoun...
The sputtering yield of aluminum oxide during reactive magnetron sputtering has been quantified by a...
International audienceA study of the reactive sputtering of aluminum was carried out by coupling ene...
The sputtering yield of aluminum oxide during reactive magnetron sputtering has been quantified by a...
The sputter yield and discharge voltage of fourteen target materials (Al, Cr, Cu, Mg, Mo, Nb, Pb, Ta...
This paper discusses a few mechanisms that can assist to answer the title question. The initial appr...
AbstractIn this paper, the so-called Berg's model was successfully employed in order to model the re...
In the further development of reactive sputter deposition, strategies which allow for stabilization ...
The four dimensional parameter space (discharge voltage and current and reactive gas flow and pressu...
When process parameters such as the reactive gas partial pressure or the discharge voltage are studi...
The complexity of the reactive magnetron sputtering process is demonstrated by four simulation examp...
The complexity of the reactive magnetron sputtering process is demonstrated by four simulation examp...
An improved theoretical understanding of the reactive magnetron sputtering process is mandatory for ...
Reactive magnetron sputtering is a well-established physical vapor technique to deposit thin compoun...
Reactive magnetron sputtering is a well-established physical vapor technique to deposit thin compoun...
Reactive magnetron sputtering is a well-established physical vapor technique to deposit thin compoun...
The sputtering yield of aluminum oxide during reactive magnetron sputtering has been quantified by a...
International audienceA study of the reactive sputtering of aluminum was carried out by coupling ene...
The sputtering yield of aluminum oxide during reactive magnetron sputtering has been quantified by a...
The sputter yield and discharge voltage of fourteen target materials (Al, Cr, Cu, Mg, Mo, Nb, Pb, Ta...
This paper discusses a few mechanisms that can assist to answer the title question. The initial appr...
AbstractIn this paper, the so-called Berg's model was successfully employed in order to model the re...
In the further development of reactive sputter deposition, strategies which allow for stabilization ...