The combination of three-dimensional integrated circuits (3D ICs) and Networks-on-Chip (NoCs) offers considerable performance improvements to Chip MultiProcessors (CMPs). Since on-chip communication is critical to the performance of the NoC-based systems, designing efficient routing methods is highly desirable. This paper presents a new adaptive and deadlock-free routing method addressing the 3D mesh-based NoCs. From a turn model's point of view, the proposed technique strives to maximize the degree of adaptiveness by minimizing the number of prohibited turns. Uneven degree of adaptiveness degrades the performance of the network to a high extent. As a result, the proposed method exploits distinct sets of rules for different planes so that a...
Three-dimensional Network-On-Chips (3D NOC) are the most efficient communication structures for comp...
International audience3D integration opens up new opportunities for future multiprocessor chips by e...
There is a seemingly endless miniaturization of electronic components, which has enabled designers t...
The combination of three-dimensional integrated circuits (3D ICs) and Networks-on-Chip (NoCs) offers...
The amalgamation of 3D VLSI technology and Networks-on-Chip (NoCs) offers a promising architectural ...
The overall performance of Network-on-Chip (NoC) is strongly affected by the efficiency of the on-ch...
The most valuable attribute of 3D Networks-on-Chip (NoCs) is the very small distance between the lay...
The overall performance of Multi-Processor System-on-Chip (MPSoC) platforms depends highly on the ef...
International audienceExisting routing algorithms for 3D deal with regular mesh/torus 3D topologies....
With the continuously increasing number of cores, on-chip communication has gained a significant rol...
Optimization of multiprocessor systems relies heavily on the efficient design of on-chip routing alg...
The degree of adaptiveness has a major impact on the performance of an adaptive routing method. This...
Three-Dimensional (3D) integration is a solution to the interconnect bottleneck in Two-Dimensional (...
Routing algorithm has a significant impact on the overall performance of network-on-chip (NoC) based...
3D ICs can take advantage of a scalable communication platform, commonly referred to as the Networks...
Three-dimensional Network-On-Chips (3D NOC) are the most efficient communication structures for comp...
International audience3D integration opens up new opportunities for future multiprocessor chips by e...
There is a seemingly endless miniaturization of electronic components, which has enabled designers t...
The combination of three-dimensional integrated circuits (3D ICs) and Networks-on-Chip (NoCs) offers...
The amalgamation of 3D VLSI technology and Networks-on-Chip (NoCs) offers a promising architectural ...
The overall performance of Network-on-Chip (NoC) is strongly affected by the efficiency of the on-ch...
The most valuable attribute of 3D Networks-on-Chip (NoCs) is the very small distance between the lay...
The overall performance of Multi-Processor System-on-Chip (MPSoC) platforms depends highly on the ef...
International audienceExisting routing algorithms for 3D deal with regular mesh/torus 3D topologies....
With the continuously increasing number of cores, on-chip communication has gained a significant rol...
Optimization of multiprocessor systems relies heavily on the efficient design of on-chip routing alg...
The degree of adaptiveness has a major impact on the performance of an adaptive routing method. This...
Three-Dimensional (3D) integration is a solution to the interconnect bottleneck in Two-Dimensional (...
Routing algorithm has a significant impact on the overall performance of network-on-chip (NoC) based...
3D ICs can take advantage of a scalable communication platform, commonly referred to as the Networks...
Three-dimensional Network-On-Chips (3D NOC) are the most efficient communication structures for comp...
International audience3D integration opens up new opportunities for future multiprocessor chips by e...
There is a seemingly endless miniaturization of electronic components, which has enabled designers t...