Add to ORKGThe presence of polyamine groups on the surface of dielectrics potentially improves the adhesion with electrochemically deposited metals. In this article, first cyanuric chloride is covalently bound to the surface hydroxyl groups of the epoxy resin. The remaining reactive sites on the coupled cyanuric chloride molecule are the used to anchor polyamines. The surface reactions are monitored and characterized by means of ATR-IR, SEM-EDS, XPS and ToF-SIMS
Fabrication of highly ordered conducting polymers on metal surfaces has received a significant inter...
International audienceThe ligand induced electroless plating (LIEP) process was recently developed a...
Surface-active amine polymerization accelera-tors can be prepared by the reaction of poly-epoxy resi...
The presence of polyamine groups on the surface of dielectrics potentially improves the adhesion wit...
The introduction of amine groups on the surface of dielectric resins improves the adhesion with elec...
The rapid evolution of microelectronics industry translates itself into a need for higher density su...
To improve adhesion between copper and epoxy resin in printed circuit board, a roughness treatment o...
The effects of the different surface modification methods on the adhesion of electroless and sputter...
Proefschrift ingediend tot het behalen van de graad van Doctor in de Ingenieurswetenschappe
This work reports on the adhesion enhancement effects of self-assembled organothiol treatment on cop...
Despite the fact that copper has continuously being used as leadframe materials in electronic packag...
The goal of this work was to evaluate chemically-functionalized block copolymers as adhesion promote...
This work reports on adhesion enhancement effects of self-assembled organothiol treatment on copper ...
Polyimide (PI) surfaces were modified to improve the adhesion strength of epoxy resin/PI joints by i...
Structural adhesive bonding offers several advantages over other types of joining. These include imp...
Fabrication of highly ordered conducting polymers on metal surfaces has received a significant inter...
International audienceThe ligand induced electroless plating (LIEP) process was recently developed a...
Surface-active amine polymerization accelera-tors can be prepared by the reaction of poly-epoxy resi...
The presence of polyamine groups on the surface of dielectrics potentially improves the adhesion wit...
The introduction of amine groups on the surface of dielectric resins improves the adhesion with elec...
The rapid evolution of microelectronics industry translates itself into a need for higher density su...
To improve adhesion between copper and epoxy resin in printed circuit board, a roughness treatment o...
The effects of the different surface modification methods on the adhesion of electroless and sputter...
Proefschrift ingediend tot het behalen van de graad van Doctor in de Ingenieurswetenschappe
This work reports on the adhesion enhancement effects of self-assembled organothiol treatment on cop...
Despite the fact that copper has continuously being used as leadframe materials in electronic packag...
The goal of this work was to evaluate chemically-functionalized block copolymers as adhesion promote...
This work reports on adhesion enhancement effects of self-assembled organothiol treatment on copper ...
Polyimide (PI) surfaces were modified to improve the adhesion strength of epoxy resin/PI joints by i...
Structural adhesive bonding offers several advantages over other types of joining. These include imp...
Fabrication of highly ordered conducting polymers on metal surfaces has received a significant inter...
International audienceThe ligand induced electroless plating (LIEP) process was recently developed a...
Surface-active amine polymerization accelera-tors can be prepared by the reaction of poly-epoxy resi...
