Fabrication processes for embedding thin chips in flat flexible substrates

These days, a lot of effort is being put in making electronic devices lighter and compacter, as the electronics market is rapidly expanding with all sorts of portable devices for home and everyday use. In this paper, a technology for embedding thin chips in flexible substrates is proposed that could be the next step for further reducing weight, while at the same time enhancing mechanical flexibility of the electronic circuitry. All stages in the technology's development cycle are discussed: from technology flow, test design and actual fabrication, to process optimization and characterization of the results. An outlook on the following steps of this technology is discussed in the conclusion