Packaging of opto-electronic devices for flexible applications

This paper presents the latest results on the development of a thin flexible package of commercially available optoelectronics with polymer multimode waveguides. The GaAs VCSELs and Photodiodes are thinned down to 20 μ m thickness, resulting in packages which can be bended to a bending radius of 2 mm with high reliability. With these actives, also waveguides and out-of-plane coupling structures are embedded inside the foil. Flexible Polyimide micromirrors were fabricated, characterized and embedded inside the foil. An embedded VCSEL to Photodiode optical waveguide link was demonstrated at a speed of 1.2 Gbs with open eye diagram. Temperature (-40 to 125 degrees Celsius) and humidity (85 rh/85 degrees C for 1000 hours) reliability was tested with good results. The total thickness of the completed foil containing actives, waveguides and coupling elements is only 145 μm