Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging

This paper reports on design and fabrication options of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems. The antenna is built using a stack of two adhesively bonded wafers with patterned metallization and through-wafer electrical interconnects. Different fabrication options based on via formation in glass and/or high-resistivity silicon substrates using excimer laser ablation or powder blasting are analyzed.Fundação para a Ciência e Tecnologia (FCT) (SFRH/BD/4717/2001, POCTI/ESE/38468/2001, FEDER), and EC (project Blue Whale IST-2000-10036)