High-resistivity polycrystalline silicon as RF substrate in wafer-level packaging

High-resistivity polycrystalline silicon (HRPS) is presented as a novel low-cost and low-loss substrate for radio-frequency (RF) passive components in wafer-level packaging and integrated passive networks. A record quality factor (Q¼11; 1 GHz; 34 nH) and very low loss (0.65 dB=cm; 17 GHz) are demonstrated for inductors and coplanar waveguides, respectively, on HRPS.EC project Bluewhale (IST-2000-10036), and of the Portugese Foundation for Science and Technology (SFRH=BD=4717=2001, POCTI=ESE=38468=2001, FEDER)