Copper and its alloys are used widely in marine environments, and anisotropic corrosion influences the corrosion kinetics of copper. Corrosion of copper in an electrolyte containing Cl− is described as a dissolution–deposition process, which is a prolonged process. Therefore, it is laborious to clarify the corrosion anisotropy in different stages. In this paper, electrochemical impedance spectroscopy (EIS) following elapsed open circuit potential (OCP) test with 0 h (0H), 24 h (24H) and 10 days (10D) was adopted. To exclude interruptions such as grain boundary and neighbor effect, single crystal (SC) Cu(100) and Cu(111) were employed. After 10D OCP, cross-sectional slices were cut and picked up by a focused ion beam (FIB). The results showe...
Copper has become a key material in semiconductors due to its use as the interconnect material in si...
Copper specimens were exposed to Sulfate-Reducing Bacteria (SRB) for 10 months under the conditions ...
The salt-film and water acceptor mechanisms were generally accepted mechanisms for Cu electrochemica...
Copper and its alloys are used widely in marine environments, and anisotropic corrosion influences t...
In the present work two electrochemical techniques were used to study passivation of a clean copper ...
Impedance spectroscopy is being used to study possible mechanisms for the observed corrosion of nano...
2 Anodic dissolution of copper in arginine and hydrogen peroxide based medium suitable for chemical ...
[[abstract]]The electrochemical impedance spectroscopy (EIS) technique has been used to investigate ...
A comparative corrosion study of Cu and Cu-Al, Cu-Al-Ni, Cu-Al-Mn and Cu-Al-Mn-Ni in 0.5 mol dm-3 Na...
The semiconducting properties of anodic passive films formed on polycrystalline copper in aqueous bo...
The electrochemical behaviour of Cu, Cu-Al and Cu-Al-Ag alloys in aqueous solutions of NaCl (0.5 M, ...
The semiconducting properties of anodic passive films formed on polycrystalline copper in aqueous bo...
Copper chemical mechanical polishing (CMP) is a key step in microelectronic interconnect fabrication...
[[abstract]]©2007 Electrochem - In this paper, the effect of impurity distribution in copper film on...
During copper CMP, abrasives and asperities interact with the copper at the nano-scale, partially re...
Copper has become a key material in semiconductors due to its use as the interconnect material in si...
Copper specimens were exposed to Sulfate-Reducing Bacteria (SRB) for 10 months under the conditions ...
The salt-film and water acceptor mechanisms were generally accepted mechanisms for Cu electrochemica...
Copper and its alloys are used widely in marine environments, and anisotropic corrosion influences t...
In the present work two electrochemical techniques were used to study passivation of a clean copper ...
Impedance spectroscopy is being used to study possible mechanisms for the observed corrosion of nano...
2 Anodic dissolution of copper in arginine and hydrogen peroxide based medium suitable for chemical ...
[[abstract]]The electrochemical impedance spectroscopy (EIS) technique has been used to investigate ...
A comparative corrosion study of Cu and Cu-Al, Cu-Al-Ni, Cu-Al-Mn and Cu-Al-Mn-Ni in 0.5 mol dm-3 Na...
The semiconducting properties of anodic passive films formed on polycrystalline copper in aqueous bo...
The electrochemical behaviour of Cu, Cu-Al and Cu-Al-Ag alloys in aqueous solutions of NaCl (0.5 M, ...
The semiconducting properties of anodic passive films formed on polycrystalline copper in aqueous bo...
Copper chemical mechanical polishing (CMP) is a key step in microelectronic interconnect fabrication...
[[abstract]]©2007 Electrochem - In this paper, the effect of impurity distribution in copper film on...
During copper CMP, abrasives and asperities interact with the copper at the nano-scale, partially re...
Copper has become a key material in semiconductors due to its use as the interconnect material in si...
Copper specimens were exposed to Sulfate-Reducing Bacteria (SRB) for 10 months under the conditions ...
The salt-film and water acceptor mechanisms were generally accepted mechanisms for Cu electrochemica...