The heat sink is a key component in thermal management of microelectronics and is traditionally designed with arrays of pins or fins. In this work, a bio-inspired approach to designing heat sinks was evaluated. A process was first developed on a 100W Laser Powder Bed Fusion (LPBF) system for the copper alloy CuNi2SiCr, which was found to have a tenfold deficit in thermal conductivity relative to commercially pure Copper. This process was then used to fabricate four heat sinks: two replicates of commercial heat sink designs, and two leveraging bio-inspired design approaches with the aim of increasing the available surface area per unit volume. The four designs were tested on a microelectronics package placed on a hot plate and ...
One of the technological challenges aimed at improving the cyclotron-based radionuclides'(RNs) suppl...
Micro-channel heat sinks are used in a wide variety of applications, including microelectronic devic...
Additive Manufacturing (AM) of copper and copper alloys has opened new frontiers in heat transfer ap...
The heat sink is a key component in thermal management of microelectronics and is traditionally de...
With the rapid rise in power dissipated by integrated circuits, improved heat sinks designs are nee...
With the rapid rise in power dissipated by integrated circuits, improved heat sinks designs are nee...
[[abstract]]The power dissipation of CPU used in desktop computers has been steadily increasing with...
The ability to design complex copper (Cu) parts into the most efficient thermal structures is an old...
This paper describes as an alternative to the silicon technology the production, assembly and perfor...
In this paper, a numerical simulation is carried out to analyse the heat transfer performance of cop...
Microchannel heat sinks allow removal of dense heat loads from high-power electronic devices at mode...
Microchannel heat sinks allow removal of dense heat loads from high-power electronic devices at mode...
Plastic injection molding is one of the fastest-growing industries in the world. However, although i...
One of the technological challenges aimed at improving the cyclotron-based radionuclides'(RNs) suppl...
Micro-channel heat sinks are used in a wide variety of applications, including microelectronic devic...
One of the technological challenges aimed at improving the cyclotron-based radionuclides'(RNs) suppl...
Micro-channel heat sinks are used in a wide variety of applications, including microelectronic devic...
Additive Manufacturing (AM) of copper and copper alloys has opened new frontiers in heat transfer ap...
The heat sink is a key component in thermal management of microelectronics and is traditionally de...
With the rapid rise in power dissipated by integrated circuits, improved heat sinks designs are nee...
With the rapid rise in power dissipated by integrated circuits, improved heat sinks designs are nee...
[[abstract]]The power dissipation of CPU used in desktop computers has been steadily increasing with...
The ability to design complex copper (Cu) parts into the most efficient thermal structures is an old...
This paper describes as an alternative to the silicon technology the production, assembly and perfor...
In this paper, a numerical simulation is carried out to analyse the heat transfer performance of cop...
Microchannel heat sinks allow removal of dense heat loads from high-power electronic devices at mode...
Microchannel heat sinks allow removal of dense heat loads from high-power electronic devices at mode...
Plastic injection molding is one of the fastest-growing industries in the world. However, although i...
One of the technological challenges aimed at improving the cyclotron-based radionuclides'(RNs) suppl...
Micro-channel heat sinks are used in a wide variety of applications, including microelectronic devic...
One of the technological challenges aimed at improving the cyclotron-based radionuclides'(RNs) suppl...
Micro-channel heat sinks are used in a wide variety of applications, including microelectronic devic...
Additive Manufacturing (AM) of copper and copper alloys has opened new frontiers in heat transfer ap...