Conventional compute and memory systems scaling to achieve higher performance and lower cost and power have diminished. Concurrently, we have diverse compute and memory-demanding workloads that continue to grow and stress traditional systems with only CPUs and DRAM. Heterogeneous compute and memory systems establish the opportunity to boost performance for these demanding workloads by providing hardware units with specialized characteristics. Specialized compute platforms such as GPUs, FPGAs, and accelerators execute specific tasks faster than CPUs, increasing performance and energy efficiency for the particular task. Heterogeneity in the memory systems, such as incorporating various memory technologies like storage class memories (SCMs) al...
Integrated Heterogeneous System (IHS) processors pack throughput-oriented General-Purpose Graphics P...
Accelerated computing has become pervasive for increasing the computational power and energy efficie...
Advancements in packaging technology enable high-bandwidth 3D-DRAM that mitigates the memory bandwid...
To address the 'memory wall' problem of future systems, vendors are creating heterogeneous memory st...
As device technologies scale in the nanometer era, the current off-chip DRAM technologies are very c...
The memory requirements of emerging applications, especially in the domain of machine learn- ing wor...
The saturation of single-thread performance, along with the advent of the power wall, has resulted i...
Hardware heterogeneity is becoming an increasingly common feature in high-performance computing syst...
High compute-density with massive thread-level parallelism of Graphics Processing Units (GPUs) is be...
The memory hierarchy is predicted to consume up to 40% to 70% of total system power in future data c...
The expeditious proliferation of Internet connectivity and the growing adoption of digital products ...
Current heterogeneous CPU-GPU architectures integrate general purpose CPUs and highly thread-level p...
Thesis (Ph. D.)--University of Rochester. Department of Electrical and Computer Engineering, 2016.Si...
Minimizing power, increasing performance, and delivering effective memory bandwidth are today's prim...
Modern HPC systems are becoming increasingly heterogeneous, affecting all components of HPC systems,...
Integrated Heterogeneous System (IHS) processors pack throughput-oriented General-Purpose Graphics P...
Accelerated computing has become pervasive for increasing the computational power and energy efficie...
Advancements in packaging technology enable high-bandwidth 3D-DRAM that mitigates the memory bandwid...
To address the 'memory wall' problem of future systems, vendors are creating heterogeneous memory st...
As device technologies scale in the nanometer era, the current off-chip DRAM technologies are very c...
The memory requirements of emerging applications, especially in the domain of machine learn- ing wor...
The saturation of single-thread performance, along with the advent of the power wall, has resulted i...
Hardware heterogeneity is becoming an increasingly common feature in high-performance computing syst...
High compute-density with massive thread-level parallelism of Graphics Processing Units (GPUs) is be...
The memory hierarchy is predicted to consume up to 40% to 70% of total system power in future data c...
The expeditious proliferation of Internet connectivity and the growing adoption of digital products ...
Current heterogeneous CPU-GPU architectures integrate general purpose CPUs and highly thread-level p...
Thesis (Ph. D.)--University of Rochester. Department of Electrical and Computer Engineering, 2016.Si...
Minimizing power, increasing performance, and delivering effective memory bandwidth are today's prim...
Modern HPC systems are becoming increasingly heterogeneous, affecting all components of HPC systems,...
Integrated Heterogeneous System (IHS) processors pack throughput-oriented General-Purpose Graphics P...
Accelerated computing has become pervasive for increasing the computational power and energy efficie...
Advancements in packaging technology enable high-bandwidth 3D-DRAM that mitigates the memory bandwid...