Add to ORKGWetting characteristics of Al-containing Sn-1Ag-0.5Cu solder alloy on Cu substrate using wetting balance and spread area method
Surface conditions on Printed Circuit Board (PCB) final finishes have an important impact on the wet...
The impact of the contact angle of a droplet, the included angle of a substrate and the droplet volu...
Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates were ass...
AbstractIn this work, we investigate the effects of 0.1 and 0.5wt.% Al additions on the wettability ...
[[abstract]]©2003 MRS - Wetting properties of lead-free solders, Sn-0.7 wt.% Cu and Sn-3.5 wt.% Ag, ...
Wetting characteristics of reactive (Sn–0.7Cu solder) and non– reactive (castor oil) wetting of liqu...
Wettability of low silver (Ag) content Sn-xAg-0.7Cu-0.5In lead-free solder (x = 0.1,0.3,0.5) on copp...
The measurements of surface tension, density and viscosity of liquid Sn-Zn eutectic alloys contai...
Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as ...
In the electronic components and device packaging process, the Cu conductor surface is generally coa...
Microstructure, wetting behavior and interfacial reactions between Sn–0.7Cu and Sn–0.3Ag–0.7Cu (SAC0...
This work investigates the effect of bismuth (Bi) addition, 1 wt% Bi, on wettability of the Sn-3.0Ag...
Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu have been investigated at temperatu...
Based on two experimental approaches: transient directional solidification and drop shape analyses, ...
Electronic packaging industries are now in great challenge to find a suitable lead-free solder as an...
Surface conditions on Printed Circuit Board (PCB) final finishes have an important impact on the wet...
The impact of the contact angle of a droplet, the included angle of a substrate and the droplet volu...
Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates were ass...
AbstractIn this work, we investigate the effects of 0.1 and 0.5wt.% Al additions on the wettability ...
[[abstract]]©2003 MRS - Wetting properties of lead-free solders, Sn-0.7 wt.% Cu and Sn-3.5 wt.% Ag, ...
Wetting characteristics of reactive (Sn–0.7Cu solder) and non– reactive (castor oil) wetting of liqu...
Wettability of low silver (Ag) content Sn-xAg-0.7Cu-0.5In lead-free solder (x = 0.1,0.3,0.5) on copp...
The measurements of surface tension, density and viscosity of liquid Sn-Zn eutectic alloys contai...
Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as ...
In the electronic components and device packaging process, the Cu conductor surface is generally coa...
Microstructure, wetting behavior and interfacial reactions between Sn–0.7Cu and Sn–0.3Ag–0.7Cu (SAC0...
This work investigates the effect of bismuth (Bi) addition, 1 wt% Bi, on wettability of the Sn-3.0Ag...
Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu have been investigated at temperatu...
Based on two experimental approaches: transient directional solidification and drop shape analyses, ...
Electronic packaging industries are now in great challenge to find a suitable lead-free solder as an...
Surface conditions on Printed Circuit Board (PCB) final finishes have an important impact on the wet...
The impact of the contact angle of a droplet, the included angle of a substrate and the droplet volu...
Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates were ass...