International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Discharge (ESD), by photon emission using spectral photoemission technique (SPE). Investigations in photoemission PE reveal the degradation signature. SPE analyses are performed to identify the failure mechanism. The ESD degradation is seems to be related to oxide degradation. C-V analyses are conducted to prove this hypothesis
International audienceEfficient energy management become more and more crucial with increasing energ...
Expansion and contraction of Shockley type stacking faults (SF) due to the glide of basal plane disl...
Spectroscopic photon emission microscopy (SPEM) is a non-destructive technique used as a defect loca...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceIn this work, ElectroStatic Discharge (ESD) tests are performed on SiC MESFETs...
International audienceIn this work, ElectroStatic Discharge (ESD) tests are performed on SiC MESFETs...
International audienceIn this work, ElectroStatic Discharge (ESD) tests are performed on SiC MESFETs...
International audienceIn this work, ElectroStatic Discharge (ESD) tests are performed on SiC MESFETs...
International audienceIn this work, ElectroStatic Discharge (ESD) tests are performed on SiC MESFETs...
International audienceIn this work, ElectroStatic Discharge (ESD) tests are performed on SiC MESFETs...
International audienceIn this work, ElectroStatic Discharge (ESD) tests are performed on SiC MESFETs...
International audienceEfficient energy management become more and more crucial with increasing energ...
International audienceEfficient energy management become more and more crucial with increasing energ...
Expansion and contraction of Shockley type stacking faults (SF) due to the glide of basal plane disl...
Spectroscopic photon emission microscopy (SPEM) is a non-destructive technique used as a defect loca...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceIn this work, ElectroStatic Discharge (ESD) tests are performed on SiC MESFETs...
International audienceIn this work, ElectroStatic Discharge (ESD) tests are performed on SiC MESFETs...
International audienceIn this work, ElectroStatic Discharge (ESD) tests are performed on SiC MESFETs...
International audienceIn this work, ElectroStatic Discharge (ESD) tests are performed on SiC MESFETs...
International audienceIn this work, ElectroStatic Discharge (ESD) tests are performed on SiC MESFETs...
International audienceIn this work, ElectroStatic Discharge (ESD) tests are performed on SiC MESFETs...
International audienceIn this work, ElectroStatic Discharge (ESD) tests are performed on SiC MESFETs...
International audienceEfficient energy management become more and more crucial with increasing energ...
International audienceEfficient energy management become more and more crucial with increasing energ...
Expansion and contraction of Shockley type stacking faults (SF) due to the glide of basal plane disl...
Spectroscopic photon emission microscopy (SPEM) is a non-destructive technique used as a defect loca...