Class-D audio amplifiers seem to be a perspective way of development of electronics as they can obtain excellent power efficiency together with good performance characteristics. Moreover, they can be easily integrated on a single chip, resulting in clear, comprehensive and non-reckless construction of the audio amplifier. Because the power efficiency is considerably high, some designs even do not need any heat sink, since the heat dissipation can be fully provided by the chip package. In this paper a construction of such an amplifier, being based on the integrated circuit TPA3122, is described. This construction has been developed at Tomas Bata University in Zlin, using conventional component base. Moreover, the paper provides a comparison ...