The present paper covers the comparison of two different configurations (square and circular) pinfin heat sinks embedded with two different phase change materials (PCMs) namely paraffin wax and n-eicosane having different thermo-physical properties were carried out for passive cooling of electronic devices. The pin-fins, acting as thermal conductivity enhancers (TCEs), of
This paper deals with phase change material (PCM), used in conjunction with thermal conductivity enh...
This study presents the parametric investigation of a phase change material (PCM) filled plate-fin h...
This study presents the parametric investigation of a phase change material (PCM) filled plate-fin h...
This experimental study presents the parametric analysis for the round pin-finned heat sinks subject...
This experimental study presents the parametric analysis for the round pin-finned heat sinks subject...
The present paper covers the comparison of two different configurations (square and circular) pinfin...
The present paper covers the comparison of two different configurations (square and circular) pinfin...
This experimental study determines and compares the thermal performance of unfinned and finned PCM b...
This study implies experimental investigation for optimization of heat transfer in electronic integr...
This study implies experimental investigation for optimization of heat transfer in electronic integr...
The present paper covers the comparison of two different configurations (square and circular) pin-fi...
This experimental study presents the parametric analysis for the round pin-finned heat sinks subject...
As the temperature of electronic devices increases, their failure rate increases. That is why electr...
This paper deals with phase change material (PCM), used in conjunction with thermal conductivity enh...
This paper deals with phase change material (PCM), used in conjunction with thermal conductivity enh...
This paper deals with phase change material (PCM), used in conjunction with thermal conductivity enh...
This study presents the parametric investigation of a phase change material (PCM) filled plate-fin h...
This study presents the parametric investigation of a phase change material (PCM) filled plate-fin h...
This experimental study presents the parametric analysis for the round pin-finned heat sinks subject...
This experimental study presents the parametric analysis for the round pin-finned heat sinks subject...
The present paper covers the comparison of two different configurations (square and circular) pinfin...
The present paper covers the comparison of two different configurations (square and circular) pinfin...
This experimental study determines and compares the thermal performance of unfinned and finned PCM b...
This study implies experimental investigation for optimization of heat transfer in electronic integr...
This study implies experimental investigation for optimization of heat transfer in electronic integr...
The present paper covers the comparison of two different configurations (square and circular) pin-fi...
This experimental study presents the parametric analysis for the round pin-finned heat sinks subject...
As the temperature of electronic devices increases, their failure rate increases. That is why electr...
This paper deals with phase change material (PCM), used in conjunction with thermal conductivity enh...
This paper deals with phase change material (PCM), used in conjunction with thermal conductivity enh...
This paper deals with phase change material (PCM), used in conjunction with thermal conductivity enh...
This study presents the parametric investigation of a phase change material (PCM) filled plate-fin h...
This study presents the parametric investigation of a phase change material (PCM) filled plate-fin h...