Improving the Resistance of Molecularly Doped Polymer Semiconductor Layers to Solvent

The ability to form multi-heterolayer (opto)electronic devices by solution processing of (molecularly doped) semiconducting polymer layers is of great interest since it can facilitate the fabrication of large-area and low-cost devices. However, the solution processing of multilayer devices poses a particular challenge with regard to dissolution of the first layer during the deposition of a second layer. Several approaches have been introduced to circumvent this problem for neat polymers, but suitable approaches for molecularly doped polymer semiconductors are much less well-developed. Here, we provide insights into two different mechanisms that can enhance the solvent resistance of solution-processed doped polymer layers while also retaining the dopants, one being the doping-induced pre-aggregation in solution and the other including the use of a photo-reactive agent that results in covalent cross-linking of the semiconductor and, perhaps in some cases, the dopant. For molecularly p-doped poly(3-hexylthiophene-2,5-diyl) and poly[2,5-bis(3-tetradecyl-thiophene-2-yl)thieno(3,2-b)thiophene] layers, we find that the formation of polymer chain aggregates prior to the deposition from solution plays a major role in enhancing solvent resistance. However, this pre-aggregation limits inclusion of the cross-linking agent benzene-1,3,5-triyl tris(4-azido-2,3,5,6-tetrafluorobenzoate). We show that if pre-aggregation in solution is suppressed, high resistance of thin doped polymer layers to solvent can be achieved using the tris(azide). Moreover, the electrical conductivity can be largely retained by increasing the tris(azide) content in a doped polymer layer