Microstructure and microtexture of rapidly solidified undercooled Ni-Cu alloys were investigated. The characteristic undercooling of Ni80Cu20 alloy was determined as 45K, 90K and 160K. Dendrite deformation due to rapid solidification led to strong deformation microtexture. Due to recrystallization upon annealing after recalescence, many subgrains were formed in the microstructure. Further, annealing the quenched alloy at 900℃, new microtextures and subgrains were formed, which was due to recrystallization and dislocation network rearrangement. The results of comparative experiment proved the recrystallization mechanism of the microstructure refinement in the non-equilibrium solidification structure of the undercooled binary alloy
The thermal and mechanical effects on microstructure of Cu-12.44%Zn-4.75%Ni (wt%) alloy were investi...
The thermal and mechanical effects on microstructure of Cu-12.44%Zn-4.75%Ni (wt%) alloy were investi...
Ag–Cu alloys, as one type of typical eutectic solders, have been widely used in microelectronic pack...
Traditional recrystallization technology is based on recrystallization annealing after artificial pl...
The solidification microstructures of undercooled Ni90Cu10 alloys under different undercoolings were...
Taking a Cu55Ni45 alloy as experimental alloy systems, we systematically studied the method of obtai...
In this paper we present the results, from what we believe is the first ever attempt to study the me...
For Cu-Ni alloy droplets processed by containerless solidification under levitation, the crystallogr...
AbstractNon-equilibrium solidification of undercooled metastable immiscible Cu50Co50 alloy was perfo...
Spontaneous grain refinement in undercooled metallic melts has been a topic of enduring interest wit...
The evolution of microstructure and micro-texture during discontinuous dynamic recrystallisation of ...
Morphology and size of dendritic microstructures sensitively depend on the solidification conditions...
The distribution of nickel in dendrite arms and in interdendritic regions of copper-10 % nickel allo...
A melt encasement (fluxing) technique has been used to systematically study the microstructural deve...
In a previous paper (Castle et al., 2014) [17], we employed a melt fluxing technique to study the ve...
The thermal and mechanical effects on microstructure of Cu-12.44%Zn-4.75%Ni (wt%) alloy were investi...
The thermal and mechanical effects on microstructure of Cu-12.44%Zn-4.75%Ni (wt%) alloy were investi...
Ag–Cu alloys, as one type of typical eutectic solders, have been widely used in microelectronic pack...
Traditional recrystallization technology is based on recrystallization annealing after artificial pl...
The solidification microstructures of undercooled Ni90Cu10 alloys under different undercoolings were...
Taking a Cu55Ni45 alloy as experimental alloy systems, we systematically studied the method of obtai...
In this paper we present the results, from what we believe is the first ever attempt to study the me...
For Cu-Ni alloy droplets processed by containerless solidification under levitation, the crystallogr...
AbstractNon-equilibrium solidification of undercooled metastable immiscible Cu50Co50 alloy was perfo...
Spontaneous grain refinement in undercooled metallic melts has been a topic of enduring interest wit...
The evolution of microstructure and micro-texture during discontinuous dynamic recrystallisation of ...
Morphology and size of dendritic microstructures sensitively depend on the solidification conditions...
The distribution of nickel in dendrite arms and in interdendritic regions of copper-10 % nickel allo...
A melt encasement (fluxing) technique has been used to systematically study the microstructural deve...
In a previous paper (Castle et al., 2014) [17], we employed a melt fluxing technique to study the ve...
The thermal and mechanical effects on microstructure of Cu-12.44%Zn-4.75%Ni (wt%) alloy were investi...
The thermal and mechanical effects on microstructure of Cu-12.44%Zn-4.75%Ni (wt%) alloy were investi...
Ag–Cu alloys, as one type of typical eutectic solders, have been widely used in microelectronic pack...