In the microelectronic industry, the ever increase in power density due to miniaturization of electronic components requires heat sink materials with a high thermal conductivity (TC), a low coefficient of thermal expansion (CTE), and specific mechanical properties (MP). Pure metals, such as Al and Cu, have been previously used. However, they have limited TCs (e.g. 240 W/m.K for Al) and their CTEs are too high (e.g. 23 × 10-6/K for Al), being incompatible with those of electronic components (e.g. 4 × 10-6/K for Si), leading to failures in service due to thermal fatigue. Regarding this, metal matrix composites have been proven to be promising material where carbon materials, such as graphite, diamond, and carbon fibres, have been introduced a...
Embedded electronic packagings are currently made of aluminum. A first study – basedupon a material ...
Due to their high thermal conductivity, metal matrix composite materials reinforced with carbon allo...
La métallurgie des poudres permet d’élaborer des pièces à des températures inférieures à la températ...
In the microelectronic industry, the ever increase in power density due to miniaturization of electr...
Many carbon/metal composites are currently used in several applications. One of them concerns their ...
Light materials with high thermal conductivity and low thermal expansion have a wide application pot...
Les matériaux composites à matrice métallique (CMM) sont actuellement étudiés pour être utilisés dan...
High thermal conductivity (TC) and a tunable coefficient of thermal expansion are essential propert...
Aluminum matrix composites reinforced with carbon fibers or diamond particles have been fabricated b...
International audienceAluminum (Al) matrix composite materials reinforced with graphite flakes (GF) ...
International audienceAn Al matrix composite reinforced with 40 vol% graphite flake (Gf) was develop...
The optimization of metal–matrix composite material is linked firstly with the intrinsic properties ...
Du fait leur conductivité thermique élevée, les matériaux composites à matrice métallique et renfort...
La plupart des équipements électroniques et électriques sont enrobés ou encapsulés par de la résine...
High thermal conductivity, low thermal expansion and low density are three important features in nov...
Embedded electronic packagings are currently made of aluminum. A first study – basedupon a material ...
Due to their high thermal conductivity, metal matrix composite materials reinforced with carbon allo...
La métallurgie des poudres permet d’élaborer des pièces à des températures inférieures à la températ...
In the microelectronic industry, the ever increase in power density due to miniaturization of electr...
Many carbon/metal composites are currently used in several applications. One of them concerns their ...
Light materials with high thermal conductivity and low thermal expansion have a wide application pot...
Les matériaux composites à matrice métallique (CMM) sont actuellement étudiés pour être utilisés dan...
High thermal conductivity (TC) and a tunable coefficient of thermal expansion are essential propert...
Aluminum matrix composites reinforced with carbon fibers or diamond particles have been fabricated b...
International audienceAluminum (Al) matrix composite materials reinforced with graphite flakes (GF) ...
International audienceAn Al matrix composite reinforced with 40 vol% graphite flake (Gf) was develop...
The optimization of metal–matrix composite material is linked firstly with the intrinsic properties ...
Du fait leur conductivité thermique élevée, les matériaux composites à matrice métallique et renfort...
La plupart des équipements électroniques et électriques sont enrobés ou encapsulés par de la résine...
High thermal conductivity, low thermal expansion and low density are three important features in nov...
Embedded electronic packagings are currently made of aluminum. A first study – basedupon a material ...
Due to their high thermal conductivity, metal matrix composite materials reinforced with carbon allo...
La métallurgie des poudres permet d’élaborer des pièces à des températures inférieures à la températ...