This paper represents a further contribution to the study of identification procedures for material mechanics resting on kinematic measurements provided by 2D Digital Image orrelation (DIC) at the microscale. Reference is made to non-conventional experiments on adhesively bonded assemblies industrially manufactured for aerospace applications. For calibration purposes a local approach is considered under plane stress conditions, focusing on a small sub-domain on the sample surface, in which mixed mode debonding is monitored. As a novelty, both the (cohesive) mechanical parameters of the interface and the actual boundary conditions prescribed at different time instants during the test are considered as unknowns to be estimated on the basis ...